LOCTITE ABLESTIK 84-1LMISNB

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • Long work life
  • High purity
  • Electrically conductive

Product Description

LOCTITE ABLESTIK 84-1LMISNB electrically conductive adhesive is designed for semiconductor packaging applications. This halogen free, heat curable adhesive is filled with silver and has high purity. Its poisson's ration, as with the majority of adhesives is 0.33. 

LOCTITE ABLESTIK 84-1LMISNB meets the requirements of MIL-STD-883, Method 5011.

Cure Schedule

  • 1 hour @ 175°C 
  • 30 minutes @ 200°C
Product Family
84-1LMISNB  
5cc Syringe 10cc Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
Density (g) 3.4 g/cm3
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
168 hours
Shelf Life
Shelf Life @ -40°C 365 days
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
115 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
3.5 W/m.K
Weight Loss @ 300°C 0.45 %
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
54 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
190 ppm/°C
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.0x10-4 Ohms⋅cm
Mechanical Properties
Shear strength
Shear Strength @25°C 29.4 N/mm2
Tensile Modulus
Tensile Modulus @-65°C 6,100 N/mm2
Tensile Modulus @150°C 450 N/mm2
Tensile Modulus @250°C 250 N/mm2
Tensile Modulus @25°C 5,000 N/mm2
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
10 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
20 ppm
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
14,000 mPa.s

Additional Information

What is the Density of 84-1LMI?

Density is typically stated for the wet state of the material. Cured density for die attach materials will be a few % higher but this is not a value that we measure. Generally, uncured (wet state) density is important for calculating usage while cured density is important for running modelling based on thermo-mechanical properties.

84-1LMI series are all “solvent free” so the weight loss on cure is small, and therefore the change in density during cure is also small.

 

Can I mix two die attach syringes together?

Customers should never remix the materials as it will change properties like TI. Please note that if you remix without our approval then we are no longer responsible for the material's end quality.

If you want to centrifuge them for void removal then, of course, this is a standard procedure for individual syringes. In this case 1 to 2 minutes at 1000rpm is sufficient on a planetary mixer. But mixing two syringes together is not advised or supported. Please contact us to see how we can resolve your issues without having to do this workaround.

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