OPTOLINQ BMC-4200| Opaque Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Opaque
  • Suitable spiral flow for molding conditions
  • Superior reliability

Product Description

OPTOLINQ BMC-4200 is a Series of Opaque molding compounds used as encapsultation of optoelectronic devices. It exhibits excellent moldability under suitable spiral flow conditions.

This material exhibits excellent thermal stability, meaning it can withstand high temperatures without significant degradation. Additionally, it possesses outstanding mechanical processing performance, making it easily moldable and shapeable during manufacturing.

The material's remarkable moldability allows for precise and intricate molding of optoelectronic devices, ensuring consistent and high-quality production. Furthermore, its superior reliability ensures that the molded devices maintain their performance and functionality over extended periods, making it a highly dependable choice for optoelectronic applications.

Molding information

OPTOLINQ BMC-4200 differs from other molding compounds and has some special procedures required.


Temperature recovery

OPTOLINQ BMC-4200 must first be allowed to achieve room temperature (20±5°C , 40±15% RH) for atleast 24 hours (Big size) and 12 hours (Small size), without opening the bag before using it, to avoid contamination.


Preheat

Preheating of OPTOLINQ BMC-4200 can be done by using standard RF equipment. The preheating should be done slowly to achieve uniform temperature. 

Product Family
BMC-4200  

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.22
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
115 °C
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
40-80 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
150-210 ppm/°C
Gel Time
Gel Time @ 175°C / 347°F 20-50 s
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 3000-3500 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
120 N/mm2
Hardness
Hot Hardness, Shore D @ 175°C 80
Physical Properties
Spiral Flow @ 175°C 80-240 cm
Curing Conditions
Transfer Time 40-60 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 3-4 hrs
Curing Schedule
Curing Time @ 175°C / 347°F 150-240 s
Mold Temperature 150-170 °C
Preheat Temperature 75-95 °C

Additional Information

Featured BMC-4200H Variants: CAPLINQ Product Offerings

BMC-4200H Optically Clear EMC with Filters

OPTOLINQ BMC for Filter Applications

Looking to enhance optical precision and durability in your filter-integrated optoelectronic devices? This short presentation introduces OPTOLINQ’s optical molding compounds specifically designed for high-performance filter applications.

Featuring BMC-4200H, a versatile formulation available in six onset wavelengths (700, 720, 750, 820, 840, and 870 nm), our optical compounds offer exceptional light control, environmental resistance, and long-term optical clarity.

Whether you're fine-tuning signal filtering, improving IR sensitivity, or ensuring high transmission and structural stability, OPTOLINQ compounds are built to perform—consistent, and reliable.

Got questions or need help selecting the right optical grade for your filter applications? Reach out to us!

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