- Home
- Products
- Thermal Interface Materials
- Phase Change Materials
- PTM6880 | Phase Change Pad
PTM6880 | Phase Change Pad
- 6,0 W/m•K thermal conductivity
- 0.056 ℃•cm²/W
- Improved flowability
Product Description
PTM6880 is a high-performance phase change material with non-pump-out properties, designed to meet the evolving demands of high-power semiconductor packaging. Featuring a thermal conductivity of 6.0 W/m·K and a thermal impedance as low as 0.056 °C·cm²/W, PTM6880 ensures efficient thermal management in high-density electronic applications.
Its superior filler loading and novel PCM polymer system enable reliable performance through 1000 thermal shock cycles and extended high-temperature operation. PTM6880’s phase change behavior at 45°C enhances its interface contact and heat transfer capabilities, making it a top choice for AI servers, data centers, power electronics, and telecom infrastructure.
Key Features:
High thermal conductivity: 6.0 W/m·K
Ultra-low thermal impedance: 0.056 °C·cm²/W
Non-pump-out performance under thermal cycling
Phase change temperature: 45°C
Optimized for bondline thickness < 1.5 mil (0.038 mm)
Available in pad format (paste version coming soon)
Technical Specifications
| General Properties | |
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 2.7 |
| Thermal Properties | |
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 6 W/m.K |
| Thermal Impedance | 0.056 °C·cm²/W |
| Electrical Properties | |
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 2.0x1014 Ohms⋅cm |
Additional Information
Solution for Application with High Pump Out Risk
PTM6880 is engineered to maintain superior thermal performance even under demanding cycling conditions where pump-out can compromise reliability. In Honeywell’s internal Pumping Out Risk Evaluation (insert link), PTM6880 demonstrated exceptionally stable thermal resistance compared to conventional phase change materials (PCMs).
During the thickness cycling test, which simulates real-world warpage effects between heat sources and heat sinks (gap variation between 120µm and 70µm), PTM6880 exhibited minimal thermal impedance increase over 750 cycles. This performance indicates strong adhesion and mechanical stability, significantly reducing the risk of material displacement under thermal stress.
By contrast, higher pump-out materials like PTM7950 showed up to 119% thermal resistance increase, while PTM6880 maintained a far lower increase ofonly 42–30%, even after extended cycling. This confirms PTM6880’s robust resistance to pump-out and ensures consistent heat transfer efficiency across device lifetimes.
PTM6880 delivers reliable long-term performance in environments with frequent thermal cycling or mechanical warpage, making it the ideal choice for applications with high pump-out risk such as power modules, advanced CPUs, and automotive electronics.