Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds

The Coef­fi­cient of Ther­mal Expan­sion (CTE) of epoxy mold com­pounds (EMC) is con­trolled by a num­ber of fac­tors, most impor­tant of which are the filler prop­er­ties includ­ing:

  • Filler type
  • Filler size
  • Filler per­cent­age (how much is in the resin)

The ther­mal con­duc­tiv­i­ty of an epoxy mold com­pound is deter­mined pri­mar­i­ly also by the filler prop­er­ties includ­ing:

  • Filler type
  • Filler Per­cent­age
  • Filler size
  • The rea­son the filler types are so impor­tant is because since the filler per­cent­age of mold com­pounds is so high, the CTE of the epoxy mold com­pound typ­i­cal­ly used in epoxy mold com­pounds include sil­i­ca,

About Chris Perabo

Chris is an energetic and enthusiastic engineer and entrepreneur. He is always interested in taking highly technical subjects and distilling these to their essence so that even the layman can understand. He loves to get into the technical details of an issue and then understand how it can be useful for specific customers and applications. Chris is currently the Director of Business Development at CAPLINQ.

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