Thermelt 867 | Low Pressure Molding (LPM)

Harmonization Code : 3908900090 | Polyamides in Primary form

Main features

Molding resin suitable for automotive applications
Good versatility for broad process and performance
Flammability UL94:V0

Product Description

Thermelt 867 Black is a pure copolymer polyamide hot melt resin, non-reactive and solvent-free, engineered specifically for low pressure molding (LPM) applications. Optimized for both automotive and electronic environments, Thermelt 867 combines excellent process versatility with high-performance thermal, mechanical, and electrical properties.

Its enhanced thermal resistance and UL94 V-0 flammability rating make it a preferred choice for overmolding connectors, cable assemblies, and sensitive electronic modules requiring robust environmental protection and electrical insulation.

Thermelt 867 was developed specifically for improving adhesion on a wide range of substrates and offers cohesiveness at negative temperatures (-50°C). It is mainly used for molding electronic/electric components, connectors and cables.

Typical Applications:

Overmolding of automotive sensors, ECUs, and wire harnesses
Encapsulation of printed circuit boards (PCBs) and electrical components
Strain relief and environmental protection of connectors and terminals

Specifications
Additional Information

Technical Specifications

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

- 50 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.2 - 0.3 W/m.K

Melting Temperature
Melting temperature	210 - 230 °C

Mechanical Properties

Tensile Strength
Tensile Strength Tensile Strength Tensile strength determines the resistance of a material to break under tension and it measures how much elongating load (or tensile stress) it can handle before fracture. To make it simple, it measures how much force we have to apply when pulling apart a material before it breaks.	6.1 MPa

Hardness
Durometer (Shore D)	45

Curing Conditions

Curing Schedule
Cure Temperature	70 °C
Mold Temperature	20 - 60 °C

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

3000 - 4000 mPa.s

Young's modulus

83 MPa