Interconnect materials are physical structures in electronics assembly that connect two or more circuit elements together electrically or thermally. They act as the “glue + highways” that allow signals, power, and heat to move efficiently between components, maintaining performance and reliability over time.

Why are Interconnect Materials Important?

Interconnect materials play a decisive role in product performance, reliability, and longevity. They form the foundation of every electronic assembly, enabling stable electrical, thermal, and mechanical connections between components and substrates.

High-quality interconnect materials support assemblies in handling mechanical stress, heat dissipation, environmental exposure, and long-term durability.

The interconnect market — encompassing materials, connectors, and assembly solutions that join electronic components — is experiencing robust expansion. Demand is driven by the increasing complexity, miniaturization, and performance requirements of modern electronic systems. Consumer electronics, automotive systems, industrial automation, telecommunications, and data-driven applications all require higher speeds, tighter tolerances, and superior electrical and thermal performance.

Beyond traditional copper-based interconnects, advanced materials and high-speed connectivity solutions are gaining traction. These innovations meet the needs of miniaturized PCB designs, high-frequency applications, and next-generation semiconductor packaging. The adoption of these materials ensures improved signal integrity, optimized thermal management, and long-term reliability in increasingly demanding environments.

Assembly Materials Across Interconnect Types

Interconnects create the pathways for power, signals, and control in electronics assemblies. Each type relies on carefully selected materials — such as solder alloys, conductive adhesives, underfills, encapsulants, and UV-cure adhesives — to ensure mechanical strength, electrical performance, and thermal reliability. Understanding the right combination of interconnect type and assembly material is essential for modern, high-density, and high-performance electronic systems.

PCB Interconnects

• Copper traces, pads, and vias
• Solder paste and reflow soldering for component attachment
• Surface finishes: ENIG, HASL, OSP
• Ensures electrical and thermal performance in high-density boards

Wire-to-Wire Interconnects

• Crimp terminals, soldered joints, or conductive adhesives
• Provides mechanical strength and electrical continuity
• Used in harnesses, power distribution, and field-serviceable wiring

Wire-to-Board Interconnects

• Soldered pins, terminals, or conductive adhesives
• Accommodates thermal expansion and mechanical stress
• Ensures reliable PCB connections for off-board components

Board-to-Board Interconnects

• Pluggable connectors, SMT headers, soldered pin arrays
• Reinforced with underfills or adhesives for mechanical stability
• Supports modular assemblies and stacked PCB designs

Flexible & Rigid-Flex Interconnects

• Polyimide-based substrates with copper traces
• Joined with low-temperature solder, ACF, or conductive adhesives
• Designed to handle bending, thermal cycling, and vibration

Chip-to-Chip & Advanced Packaging

• Wire bonding, flip-chip solder bumps, microbumps, TSVs
• High-reliability solder alloys, underfills, and encapsulants
• Maintains electrical connectivity, mechanical integrity, and thermal performance in high-density packages

 

 

CAPLINQ supports reliable interconnect performance across a wide range of electronics assembly applications. Explore materials designed to enhance electrical conductivity, mechanical stability, and long-term reliability in modern electronic systems.