EMC-G208 | Epoxy Molding Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features

High Tg
Good moldability
Low stress & water absorption

Product Description

LINQSOL™ EMC-G208 is a halogen-free epoxy molding compound engineered for micro SD cards and other thin, high-density packages. Its high-filler, low-CTE matrix controls warpage, while a high glass-transition temperature of 185 °C secures thermal stability under aggressive reflow profiles. Excellent flow and low melt viscosity promote void-free transfer molding through long, narrow cavities. Superior flow enables >500 consecutive shots per mold and formulation meets UL 94 V-0 flammability for robust safety margins. EMC-G208 is designed to satisfy JEDEC MSL-3 reliability requirements and strict ionic cleanliness limits.

LINQSOL™ EMC-G208 guarantees strong performance and outstanding long-term reliability in demanding environments. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, EMC-G208 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

LINQSOL EMC-G208 is available in custom pellet dimensions. Contact us for detailed specifications.

Key Features

Low CTE (11 ppm / °C) – Matches silicon to minimise thermo-mechanical stress.
High Tg 185 °C – Stable mechanical properties through lead-free reflow profiles.
Fast Gel Time (27 s @ 175 °C) – Supports high-throughput, short-cycle transfer moulding.
Long Spiral-Flow (60 in / 152 cm) – Ensures complete cavity fill in multi-site Micro SD lead-frame moulds.
Moisture Resistance (0.40 % @ PCT, 24 h) – Enables JEDEC Level 3 reliability.
Halogen- & Sb-Free, UL 94 V-0 – Meets global environmental and safety regulations without restricted additives.

Applications / Suitable For

Micro SD / TF memory cards
Other flash-memory modules (SD, MMC, eMMC)
Thin, warpage-sensitive laminate or lead-frame packages
Low-profile SiP cards and high-density storage devices
Small-outline sensors or controllers requiring high Tg and low CTE

Specifications
Additional Information

Technical Specifications

General Properties

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.94

Electrical Properties

Dissipation Factor
Dissipation Factor @ 25°C /1000 kHz	0.01

Dielectric Constant
Dielectric Constant @ 1000 kHz	3.8

Mechanical Properties

Molded Shrinkage

0.24 %

Flexural Modulus
Flexural Modulus @ 25°C	18000 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	150 N/mm2

Chemical Properties

Water Absorption

0.4 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	- ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	10 ppm

Physical Properties

Spiral Flow @ 175°C

152.4 cm

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

9000 mPa.s

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

185 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.79496 W/m.K

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	11 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	45 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	27 s

Additional Information

Recommended mold parameters

Parameter	Value	Unit
Molding temperature	170–180	°C
Transfer pressure	40–70	kgf/cm²
Transfer time	10–20	s
Cure time at 175 °C	120–150	s
Post-mold cure time at 175 °C	6–8	h

The curing conditions provided are recommended guidelines based on typical laboratory results. Actual curing parameters should be defined and validated by the user to ensure compatibility with specific materials, part geometries, and end-use requirements. It is the user’s responsibility to optimize and confirm curing conditions that meet their performance and quality standards.

Processing Instructions

Before use, let LINQSOL EMC-G208 reach room temperature (23±5 °C) for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL™ EMC-G208 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.

The technical information presented in this document is provided for reference only and does not constitute a guarantee of specific properties or performance. Actual results may vary depending on individual conditions and application methods. Users are strongly advised to perform their own testing and validation to determine suitability for their intended use and compliance with relevant regulations.