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- EMC-G836 | Epoxy Molding Compound
EMC-G836 | Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- For QFN & QFP packages
- Meets JEDEC MSL 3 reliability requirements
- High spiral flow
Product Description
LINQSOL EMC-G836 is a halogen-free epoxy molding compound engineered for the precise encapsulation of a wide range of semiconductor packages, including Quad Flat No-Leads (QFN), Quad Flat Packages (QFP), and other thin, high-density packages like BGA TF cards (microSD). Its design focuses on delivering both superior performance and exceptional reliability.
Product Key Features
- Wide gel time (36s) — offers a broader processing window, ideal for QFN and QFP molding applications.
- High spiral flow (149cm) — meets demanding flowability requirements for intricate package designs.
- Low water absorption
- RoHS and REACH compliant
Applications
- Encapsulation of quad flat no-leads (QFN) & quad flat packages (QFP)
- Encapsulation of thin, high-density packages, including BGA TF cards (microSD)
Technical Specifications
| General Properties | |
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 2 |
| Physical Properties | |
| Spiral Flow @ 175°C | 149 cm |
| Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application | 18000 mPa.s |
| Thermal Properties | |
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 120 °C |
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 0.92 W/m.K |
| UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole | V-0 |