HGP12 | High Thermal Conductivity Gap Pad

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

Main features

0.13 Thermal Impedance
12 Thermal Conductivity
Low oil bleeding & Low volatile

Product Description

Solstice HGP12 is a high-performance thermally conductive gap pad designed to efficiently transfer heat between components and heat sinks in demanding electronic systems.
With a thermal conductivity of 12.0 W/m·K, Solstice HGP12 provides exceptional heat dissipation and helps lower thermal resistance across multiple gap tolerances.

Its ultra-soft and compressible structure ensures excellent surface conformity and reduces mechanical stress on components during installation. HGP12 also maintains material integrity with low volatility (D3–D10 < 100 ppm) and minimal oil bleeding, making it ideal for devices sensitive to silicone migration or contamination.

Applications

Optical modules and communication components
Telecommunications equipment
High-power lighting such as LCD, LED, and projector assemblies
Automotive control units (e.g., MCU, ECU)
Power modules and other heat-generating devices

Specifications
Additional Information

Technical Specifications

General Properties
Color Color The color	Pink
Film Thickness Film Thickness Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.	0.5 - 2 mm
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.	3.3
Thermal Properties
Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.	12.0 W/m.K
Thermal Impedance	0.13 °C·cm²/W
UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole	V-0
Electrical Properties
Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.	1.4x10¹³ Ohms⋅cm

Additional Information

Frequently Asked Questions About HGP12 (12 W/m·K Ultra-Soft Thermal Gap Pad)

What are typical applications for HGP12?

HGP12 is used as a high-performance thermal interface material for heat dissipation in sensitive electronic modules.

Optical modules
Telecommunications equipment TIM
High-power lighting such as LCD, LED, projectors
Automotive MCU control units

Why choose HGP12 over alternatives?

HGP12 combines very high thermal conductivity (12 W/m·K) with ultra-soft, low-pressure compression, low volatility, and extremely low siloxane content—making it ideal for sensitive electronics where contamination control and stress-free assembly are critical.

What is the shelf life of HGP12?

HGP12 has a shelf life of 12 months when stored at 0–35°C and below 65% relative humidity.

How do I clean tools after applying HGP12?

Tools can be cleaned using standard solvents suitable for silicone-based TIM removal, such as isopropyl alcohol or other electronics-safe cleaners.

What happens after shelf life?

After the shelf life expires, material softness and compression characteristics may change, potentially affecting thermal performance and assembly reliability.

How do I cure HGP12?

HGP12 is a ready-to-use gap pad and requires no curing. It is installed as-is between components and heat spreaders.

What thickness should I apply?

Choose a thickness that matches your mechanical gap. The ultra-soft nature of HGP12 allows it to compress under very low pressure to fill tolerances effectively.

How is it applied and removed?

HGP12 is placed manually or with automated pick-and-place onto the interface area. Removal is done by peeling the pad from the surface without special tools.

What temperatures can it withstand?

HGP12 provides reliable thermal and electrical performance across typical electronics operating temperatures, including high-power modules. (TDS does not specify exact range.)

Any safety or storage tips?

Store between 0–35°C at <65% RH. Avoid contamination of pad surfaces before assembly. Follow standard handling guidelines for silicone-based thermal materials.

Learn More About HGP12 (12 W/m·K Ultra-Soft Thermal Gap Pad)

HGP12 is a high-conductivity, ultra-soft silicone gap pad designed to deliver efficient heat transfer while minimizing compression force on sensitive components. It offers low volatility, low siloxane content, and excellent wetting of uneven surfaces for stable long-term performance.

Key Features at a Glance

✔ 12.0 W/m·K thermal conductivity
✔ Ultra-soft, low-pressure compression
✔ Excellent interface wetting
✔ Low volatility & low siloxane
✔ High dielectric strength
✔ UL 94 V-0 equivalent safety rating

Versatile Application Methods

Application Methods

HGP12 is installed as a pre-cut pad placed directly between heat-generating components and heat sinks. Its softness enables hand placement or automated assembly without high clamping force.

Reliable Across Environments

Low volatile content and low oil bleed ensure stable performance in optical, telecom, and automotive environments sensitive to contamination.

Compliance You Can Trust ✅

HGP12 meets stringent safety, performance, and material compliance standards required for high-end electronics.

UL 94 V-0 flame retardancy (equivalent)
Low volatility per ASTM E595
Low siloxane (D3–D10 < 100 ppm)
High dielectric strength
ASTM D5470 thermal performance validation
ASTM D257 electrical insulation compliance

Applications That Benefit Most from High Thermal Conductive HGP12

Case 1: Improving Thermal Efficiency in High-Density 5G RF Amplifiers

5G telecom base stations rely on high-power RF power amplifier (PA) modules that generate significant heat densities. As module power output increases, maintaining thermal stability and preventing derating becomes a major design challenge which may results to thermal throttling.

Technical Issues:

Hotspots of +18°C above average due to poor conformability
Module derating occurred during extended high power operation
Long-term reliability concerns (voiding, pump-out, bleed contamination)

Case 2: Enhancing Thermal Management in High-Power Industrial LED Lighting

High-power industrial LED fixtures such as those used in factories, warehouses, tunnels, and outdoor infrastructure operate continuously and generate significant heat at the LED junction. Excess heat leads to lumen depreciation, color shift, and premature failure, making efficient thermal management essential for maintaining long service life and consistent light output.

Technical Issues:

LED junction temperatures exceeding design limits, causing early lumen drop-off
Hotspot formation due to uneven metal-core PCB (MCPCB) surface contact
Thermal grease dry-out over time leading to increased thermal resistance
Long-term reliability concerns during 24/7 operation in hot or enclosed environments

Case 3: Improving Thermal Control in AI Servers and GPU Accelerator Modules

Modern AI training and inference servers use multi-die GPU accelerators that generate extreme heat fluxes, especially during sustained workloads. Maintaining low thermal resistance across complex module topographies is essential to prevent performance throttling and maintain system uptime in data centers.

Technical Issues:

High heat flux (exceeding 300 W/cm²) from stacked GPU dies
Gap variation due to tolerances in heat spreaders and interposers
Performance throttling during extended ML training workloads
Long-term aging concerns with traditional pads at elevated temperatures

Case 4: Thermal Stabilization in Automotive ADAS Control Units

Advanced Driver Assistance Systems (ADAS) rely on high-power processors, radar modules, and sensor fusion units that operate continuously under harsh automotive temperature cycles. These compact modules generate high heat loads that must be controlled to prevent thermal throttling and loss of processing performance.

Technical Issues:

Peak temperatures approaching thermal throttling threshold during continuous lane-assist operation
Uneven PCB-to-housing gaps due to vibration and mechanical tolerances
Traditional gap fillers showing micro-voiding after extended thermal cycling
Risk of reduced processing speed and degraded ADAS reliability

How HGP12 Helps in These Cases

Solstice HGP12 provides a consistent thermal advantage across all the applications mentioned. Its high thermal conductivity of 12 W/m·K allows heat to move quickly away from critical components, helping to lower junction temperatures and prevent performance loss under heavy load. Overall, HGP12 supports reliable heat transfer, improves operational stability, and helps extend the lifetime of electronics that operate under high thermal stress.