HGP12 | High Thermal Conductivity Gap Pad

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.13 Thermal Impedance
  • 12 Thermal Conductivity
  • Low oil bleeding & Low volatile

Product Description

Solstice HGP12 is a high-performance thermally conductive gap pad designed to efficiently transfer heat between components and heat sinks in demanding electronic systems.
With a thermal conductivity of 12.0 W/m·K, Solstice HGP12 provides exceptional heat dissipation and helps lower thermal resistance across multiple gap tolerances.

Its ultra-soft and compressible structure ensures excellent surface conformity and reduces mechanical stress on components during installation. HGP12 also maintains material integrity with low volatility (D3–D10 < 100 ppm) and minimal oil bleeding, making it ideal for devices sensitive to silicone migration or contamination.

Applications

  • Optical modules and communication components
  • Telecommunications equipment
  • High-power lighting such as LCD, LED, and projector assemblies
  • Automotive control units (e.g., MCU, ECU)
  • Power modules and other heat-generating devices
Product Family
HGP12  
457 x 457 x 1.0mm

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks

Technical Specifications

General Properties
Color
Color
The color
Pink
Film Thickness
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
0.5 - 2 mm
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
3.3
Outgassing
CVCM
CVCM
Collected Volatile Condensable Materials
0.03 %
TML
TML
Total Mass Loss
0.13 %
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
12.0 W/m.K
Thermal Impedance 0.13 °C·cm²/W
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V-0
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.4x1013 Ohms⋅cm
Dielectric Constant
Dielectric Constant @ 1000 kHz 5.5
Mechanical Properties
Hardness
Durometer (Shore 00) 30