HGP14 | High Thermal Conductivity Gap Pad

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.10 Thermal Impedance
  • 14 Thermal Conductivity
  • Low oil bleeding & Low volatile

Product Description

Honeywell HGP14 is a high-performance thermal interface material designed for efficient heat transfer in demanding electronic applications. It offers a thermal conductivity of 14.0 W/m·K, making it well-suited for systems requiring high thermal dissipation across varying bond line thicknesses.
The material is soft and conformable, allowing it to fill gaps between components and heat sinks without introducing significant mechanical stress. This makes it suitable for use with fragile components or assemblies where minimizing stress during installation is critical.

HGP14 also maintains material integrity over time, with low volatility and minimal oil bleed, reducing the risk of contamination or pump-out under thermal cycling. Its stability makes it a strong choice for applications sensitive to oil migration or where long-term performance is required.
Honeywell HGP14 is well-suited for high-power electronics, automotive systems, and telecommunications equipment, where superior heat dissipation and long-term stability are essential. 

Product Family
HGP14  
457 x 457 x 1.0mm

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Gray
Film Thickness
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
 0.5 - 2 mm
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 3.3
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 14.0 W/m.K
Thermal Impedance 0.1 °C·cm²/W
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V-0
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 1.0x1013 Ohms⋅cm

Additional Information

Applications That Benefit Most from High Thermal Conductive HGP14

Case 1: Improving Thermal Efficiency in High-Density 5G RF Amplifiers

5G telecom base stations rely on high-power RF power amplifier (PA) modules that generate significant heat densities. As module power output increases, maintaining thermal stability and preventing derating becomes a major design challenge which may results to thermal throttling.

 

 

 

Technical Issues:

  • Hotspots of +18°C above average due to poor conformability
  • Module derating occurred during extended high power operation
  • Long-term reliability concerns (voiding, pump-out, bleed contamination)
Case 2: Enhancing Thermal Management in High-Power Industrial LED Lighting

High-power industrial LED fixtures such as those used in factories, warehouses, tunnels, and outdoor infrastructure operate continuously and generate significant heat at the LED junction. Excess heat leads to lumen depreciation, color shift, and premature failure, making efficient thermal management essential for maintaining long service life and consistent light output.




Technical Issues:

  • LED junction temperatures exceeding design limits, causing early lumen drop-off
  • Hotspot formation due to uneven metal-core PCB (MCPCB) surface contact
  • Thermal grease dry-out over time leading to increased thermal resistance
  • Long-term reliability concerns during 24/7 operation in hot or enclosed environments
Case 3: Improving Thermal Control in AI Servers and GPU Accelerator Modules

Modern AI training and inference servers use multi-die GPU accelerators that generate extreme heat fluxes, especially during sustained workloads. Maintaining low thermal resistance across complex module topographies is essential to prevent performance throttling and maintain system uptime in data centers.




Technical Issues:

  • High heat flux (exceeding 300 W/cm²) from stacked GPU dies
  • Gap variation due to tolerances in heat spreaders and interposers
  • Performance throttling during extended ML training workloads
  • Long-term aging concerns with traditional pads at elevated temperatures
Case 4: Thermal Stabilization in Automotive ADAS Control Units

Advanced Driver Assistance Systems (ADAS) rely on high-power processors, radar modules, and sensor fusion units that operate continuously under harsh automotive temperature cycles. These compact modules generate high heat loads that must be controlled to prevent thermal throttling and loss of processing performance.




Technical Issues:

  • Peak temperatures approaching thermal throttling threshold during continuous lane-assist operation
  • Uneven PCB-to-housing gaps due to vibration and mechanical tolerances
  • Traditional gap fillers showing micro-voiding after extended thermal cycling
  • Risk of reduced processing speed and degraded ADAS reliability

How HGP14 Helps in These Cases

Solstice HGP14 provides a consistent thermal advantage across all the applications mentioned. Its high thermal conductivity of 14 W/m·K allows heat to move quickly away from critical components, helping to lower junction temperatures and prevent performance loss under heavy load. Overall, HGP14 supports reliable heat transfer, improves operational stability, and helps extend the lifetime of electronics that operate under high thermal stress.