HGPA12 | High Thermal Conductivity Gap Pad

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.14 Thermal Impedance
  • 12 Thermal Conductivity
  • Low oil bleeding & Low volatile

Product Description

Honeywell HGPA12 is a version of HGP12 developed for automated assembly lines requiring consistent quality and repeatable performance. With a thermal conductivity of 12.0 W/m·K, HGPA12 ensures efficient heat transfer in demanding power electronics, telecommunications, and data-center applications.

The material is formulated to deliver low residual stress, helping protect pressure-sensitive components during assembly. HGPA12 maintains long-term integrity with low volatility (D3–D10 < 100 ppm) and minimal oil bleed, making it suitable for environments where contamination control is critical.

Its balanced mechanical profile Shore 00 hardness of 45 gives the pad enough compliance for good surface wetting while still retaining structural stability for automated handling and placement.

Applications

  • Telecommunications modules
  • GPUs, CPUs, and data-center hardware
  • High-power lighting (LED, LCD, projectors)
  • Wireless communication devices
  • General electronics requiring automated TIM placement

 

Product Family
HGPA12  
457 x 457 x 1.0mm

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Grayish Green
Film Thickness
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
 0.5 - 5 mm
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 3.3
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 12.0 W/m.K
Thermal Impedance 0.14 °C·cm²/W
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V-0
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 1.0x1013 Ohms⋅cm

Additional Information

Frequently Asked Questions About HGPA12 (12 W/m·K Thermal Gap Pad for Automation)

What are typical applications for HGPA12?


HGPA12 is used in advanced electronics requiring high thermal conductivity and compatibility with automated assembly.

  • Telecommunications hardware
  • GPU modules and data center equipment
  • High-power lighting systems
  • Wireless and RF devices

Why choose HGPA12 over alternatives?


HGPA12 offers 12 W/m·K performance with low residual stress, low oil bleed, and extremely low siloxane levels. Its formulation is specifically optimized for automated assembly lines and pressure-sensitive components.

What is the shelf life of HGPA12?

HGPA12 has a 12-month shelf life when stored between 0–35°C.

How do I clean tools after applying HGPA12?

Tools can be cleaned with electronics-safe solvents such as isopropyl alcohol to remove silicone residues if needed.

What happens after shelf life?

After the shelf life, mechanical and compression properties may shift, potentially affecting interface performance and consistency in automated assembly.

How do I cure HGPA12?

HGPA12 is a non-curing gap pad. It is installed directly and requires no heat or UV curing.

What thickness should I apply?

HGPA12 is available in 0.5–5.0 mm thickness. Select the thickness that matches your mechanical stack-up and compression targets.

How is it applied and removed?

HGPA12 can be placed manually or via automated pick-and-place equipment. It can be peeled off during rework and replaced as needed without damaging sensitive components.

What temperatures can it withstand?

HGPA12 operates reliably between -40°C and +125°C, making it suitable for telecom, data center, and high-power applications.

Any safety or storage tips?

Store between 0–35°C. Avoid contaminating pad surfaces and follow general handling guidelines for silicone-based TIMs.

Learn More About HGPA12 (12 W/m·K Thermal Gap Pad)

HGPA12 is a high-conductivity silicone gap pad engineered for automated assembly and pressure-sensitive electronics. It provides excellent thermal transfer, stable mechanical integrity, and low contamination risk in sensitive environments.

Key Features at a Glance

  • ✔ 12.0 W/m·K thermal conductivity
  • ✔ Automation-friendly formulation
  • ✔ Low residual stress
  • ✔ Low siloxane and low volatility
  • ✔ Wide -40°C to +125°C operating range
  • ✔ UL 94 V-0 equivalent
HGPA12 pad sample
HGPA12 pad installed in assembly

Versatile Application Methods 🧰

Application Methods

HGPA12 supports manual or automated placement onto CPUs, GPUs, telecom modules, or lighting assemblies. Its mechanical robustness provides consistent compression in high-volume production.

Reliable Across Environments 

Low volatile content, low oil bleed, and stable mechanical behavior make HGPA12 suitable for telecom, wireless, GPU, and lighting systems operating in harsh conditions.

Compliance You Can Trust ✅

HGPA12 meets key global standards for thermal interface safety and performance.

  • UL 94 V-0 flame retardancy
  • Low volatility per ASTM E595
  • ASTM D5470 thermal validation
  • ASTM D257 electrical insulation
  • Low siloxane (D3–D10 <100 ppm)
  • Wide operating temperature compliance (-40°C to +125°C)
Applications That Benefit Most from High Thermal Conductive HGP12PA

Case 1: Improving Thermal Efficiency in High-Density 5G RF Amplifiers

5G telecom base stations rely on high-power RF power amplifier (PA) modules that generate significant heat densities. As module power output increases, maintaining thermal stability and preventing derating becomes a major design challenge which may results to thermal throttling.

 

 

 

Technical Issues:

  • Hotspots of +18°C above average due to poor conformability
  • Module derating occurred during extended high power operation
  • Long-term reliability concerns (voiding, pump-out, bleed contamination)
Case 2: Enhancing Thermal Management in High-Power Industrial LED Lighting

High-power industrial LED fixtures such as those used in factories, warehouses, tunnels, and outdoor infrastructure operate continuously and generate significant heat at the LED junction. Excess heat leads to lumen depreciation, color shift, and premature failure, making efficient thermal management essential for maintaining long service life and consistent light output.




Technical Issues:

  • LED junction temperatures exceeding design limits, causing early lumen drop-off
  • Hotspot formation due to uneven metal-core PCB (MCPCB) surface contact
  • Thermal grease dry-out over time leading to increased thermal resistance
  • Long-term reliability concerns during 24/7 operation in hot or enclosed environments
Case 3: Improving Thermal Control in AI Servers and GPU Accelerator Modules

Modern AI training and inference servers use multi-die GPU accelerators that generate extreme heat fluxes, especially during sustained workloads. Maintaining low thermal resistance across complex module topographies is essential to prevent performance throttling and maintain system uptime in data centers.




Technical Issues:

  • High heat flux (exceeding 300 W/cm²) from stacked GPU dies
  • Gap variation due to tolerances in heat spreaders and interposers
  • Performance throttling during extended ML training workloads
  • Long-term aging concerns with traditional pads at elevated temperatures
Case 4: Thermal Stabilization in Automotive ADAS Control Units

Advanced Driver Assistance Systems (ADAS) rely on high-power processors, radar modules, and sensor fusion units that operate continuously under harsh automotive temperature cycles. These compact modules generate high heat loads that must be controlled to prevent thermal throttling and loss of processing performance.




Technical Issues:

  • Peak temperatures approaching thermal throttling threshold during continuous lane-assist operation
  • Uneven PCB-to-housing gaps due to vibration and mechanical tolerances
  • Traditional gap fillers showing micro-voiding after extended thermal cycling
  • Risk of reduced processing speed and degraded ADAS reliability

How HGP12PA Helps in These Cases

Solstice HGP12PA provides a consistent thermal advantage across all the applications mentioned. Its high thermal conductivity of 12 W/m·K allows heat to move quickly away from critical components, helping to lower junction temperatures and prevent performance loss under heavy load. Overall, HGP12 supports reliable heat transfer, improves operational stability, and helps extend the lifetime of electronics that operate under high thermal stress.