HGPA12 | High Thermal Conductivity Gap Pad

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.14 Thermal Impedance
  • 12 Thermal Conductivity
  • Low oil bleeding & Low volatile

Product Description

Honeywell HGPA12 is a high-performance thermal gap pad engineered for automated assembly lines requiring consistent quality and repeatable performance. With a thermal conductivity of 12.0 W/m·K, HGPA12 ensures efficient heat transfer in demanding power electronics, telecommunications, and data-center applications.

The material is formulated to deliver low residual stress, helping protect pressure-sensitive components during assembly. HGPA12 maintains long-term integrity with low volatility (D3–D10 < 100 ppm) and minimal oil bleed, making it suitable for environments where contamination control is critical.

Its balanced mechanical profile Shore 00 hardness of 45 gives the pad enough compliance for good surface wetting while still retaining structural stability for automated handling and placement.

Applications

  • Telecommunications modules
  • GPUs, CPUs, and data-center hardware
  • High-power lighting (LED, LCD, projectors)
  • Wireless communication devices
  • General electronics requiring automated TIM placement

 

Product Family
HGPA12  
457 x 457 x 1.0mm

Catalog Product

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Technical Specifications

General Properties
Color
Color
The color
Grayish Green
Film Thickness
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
0.5 - 5 mm
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
3.3
Outgassing
CVCM
CVCM
Collected Volatile Condensable Materials
0.03 %
TML
TML
Total Mass Loss
0.11 %
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
12.0 W/m.K
Thermal Impedance 0.14 °C·cm²/W
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V-0
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.0x1013 Ohms⋅cm
Dielectric Constant
Dielectric Constant @ 1000 kHz 5.7
Mechanical Properties
Hardness
Durometer (Shore 00) 45

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