Hysol GR510 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • High filler loading
  • Ultra low CTE of 8 ppm/°C
  • Designed for Quad Flat Pack (QFP) devices

Product Description

Hysol GR510 is a black, ultra-low CTE, transfer molded semiconductor epoxy molding compound designed for thin and larger quad flat pack (QFP) and larger small outline transistor (SOT) packages . Once transfer molded and post-mold cured, it has a very low CTE, low moisture absorption and high adhesion to a range of leadframe types. This allows it to acheive very high reliability levels for quad flat pack devices, but also for a range of larger SOIC packages.

Hysol GR510 has an ultra low coefficient of thermal expansion (CTE) of 8 ppm/°C that makes it one of the lowest stress materials avaiable in an epoxy molding compound. This low CTE comes from a technical breakthrough in filler size, filler type and filler loading. It has been successfully used for the production of printer heads from industry leading companies.

Hysol GR510 is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on quad flat pack devices and other, larger small outline packages including SOT, SOD and SMX package types. Hysol GR510 meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.

Product Family
GR510 Black  
Pellet Powder
N/A mm 25 mm
N/A gr 18 gr
15 kg

Catalog Product

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Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 88 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.99
Shelf Life
Shelf Life @ 5°C 183 days
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.0x1016 Ohms⋅cm
Water Extract Data
Conductivity 20 mmhos/cm
Dielectric Constant
Dielectric Constant @ 1000 kHz 3.8
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
113 °C
Loss modulus peak @ DMA 111
Tan δ peak @ DMA 119
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V0
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
27 ppm/°C
Gel Time
Gel Time @ 175°C / 347°F 36 s
Mechanical Properties
Water Extract Data
pH of extract 4.1
Flexural Modulus
Flexural Modulus @ 25°C 21,287 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
162 N/mm2
Storage (DMA) Modulus
Storage (DMA) Modulus @ 175°C 844 N/mm2
Storage (DMA) Modulus @ 25°C 24,643 N/mm2
Storage (DMA) Modulus @ 260°C 717 N/mm2
Hardness
Hot Hardness, Shore D @ 175°C 81
Chemical Properties
Moisture absorption 0.21 %
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
5.9 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
3.5 ppm
Curing Conditions
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 5 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 4 - 8 hrs
Curing Schedule
Curing Time @ 175°C / 347°F 70 - 120 s
Mold Temperature 170 - 190 °C
Preheat Temperature 70 - 90 °C
Physical Properties
Spiral Flow @ 175°C 111.8 cm

Additional Information

GR510 is a product that can replace GR828-FC1 for power SOTs. FC initials might remind you of Fairchild. Fairchild has been acquired by Onsemi in 2017 so their products still live on.