Hysol GR710F | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Hysol GR710F | Black Epoxy Mold Compound

Main features

Halogen free
Low moisture absorption
High reliability

Product Description

Hysol GR710F is a halogen free, black, spherical silica filled (75um cut size) semiconductor grade epoxy molding compound. It has high adhesion, low moisture absoprtion (0.2%) and a Tg of ~115°C.

Hysol GR710F is a technologically advanced, halogen free epoxy molding compound with good electrical performance, designed for high reliability applications with low moisture absorption requirements. Typical packages can be T0, SOIC16, TSOP and SSOP packages. It delivers outstanding performance and ease of use and it meets UL 94 V-0 flammability at 1/8 inch thickness. This product is a substitute for Hysol GR825-73B.

Available Version:

Product Family
GR710F

1. Select Product Form

Pellet

2. Available Pellet Size

16 mm

3. Available Pellet Weight

7.3 gr

4. Available Package Size

10 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Filler Content

88 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.98

Shelf Life
Shelf Life @ 5°C	183 days

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

5.0x10¹⁶ Ohms⋅cm

Chemical Properties

Moisture absorption

0.2 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	9 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	4 ppm

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

115 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

0.86 W/m.K

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	9 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	37 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	31 s

Mechanical Properties

Water Extract Data
pH of extract	5

Flexural Modulus
Flexural Modulus @ 25°C	24300 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	142 N/mm2

Curing Conditions

Transfer Pressure

40 - 85 kg/cm2

Transfer Time

7 - 15 s

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	4 - 8 hrs

Curing Schedule
Curing Time @ 175°C / 347°F	90 - 150 s
Mold Temperature	170 - 185 °C
Preheat Temperature	70 - 90 °C

Physical Properties

Spiral Flow @ 175°C

93 cm

Additional Information

GR710F Series Property Comparison

Property	Unit	GR710F	GR710F (GN)	GR710F (GN26)
Epoxy type	-	-	MAR+LMW	MAR+LMW
Hardener type	-	-	MAR	MAR
Filler content	%	89	87	87
Filler type	-	Spherical	Spherical	Spherical
Filler cut size	μm	75	75	75
Spiral Flow	inches	42	50	38
Gel Time	sec	30	30	31
Tg by TMA	°C		112
CTE 1	ppm/°C		9
CTE 2	ppm/°C		34
DMA Modulus at RT	MPa	28176	26451	26557
DMA Modulus at 175°C	MPa	752	620	523
DMA Modulus at 260°C	MPa	637	541	440
Flexural modulus at 25°C	MPa	24489	22000	24300
Flexural strength at 25°C	MPa	150	120	142
Moisture absorption PCT24h	%	0.20	0.29	0.25
Volume resistivity	×10¹⁵ Ω·cm	65	60	50
Comparative Tracking Index	V	575	600	575