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- Hysol GR710F | Black Epoxy Mold Compound
Hysol GR710F | Black Epoxy Mold Compound
- Halogen free
- Low moisture absorption
- High reliability
Product Description
Hysol GR710F is a halogen free, black, spherical silica filled (75um cut size) semiconductor grade epoxy molding compound. It has high adhesion, low moisture absoprtion (0.2%) and a Tg of ~115°C.
Hysol GR710F is a technologically advanced, halogen free epoxy molding compound with good electrical performance, designed for high reliability applications with low moisture absorption requirements. Typical packages can be T0, SOIC16, TSOP and SSOP packages. It delivers outstanding performance and ease of use and it meets UL 94 V-0 flammability at 1/8 inch thickness. This product is a substitute for Hysol GR825-73B.
Available Version:
Technical Specifications
| General Properties | |
| Filler Content | 88 % |
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.98 |
| Electrical Properties | |
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 5.0x1016 Ohms⋅cm |
| Chemical Properties | |
| Moisture absorption | 0.2 % |
| Thermal Properties | |
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 115 °C |
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 0.86 W/m.K |
| Curing Conditions | |
| Transfer Pressure | 40 - 85 kg/cm2 |
| Transfer Time | 7 - 15 s |
| Physical Properties | |
| Spiral Flow @ 175°C | 93 cm |
Additional Information
GR710F Series Property Comparison
| Item | Unit | GR710F | GR710F GN | GR710F GN26 |
|---|---|---|---|---|
| Epoxy resin | MAR+LMW | MAR+LMW | MAR+LMW | |
| Filler content | % | 89 | 88 | 87 |
| Filler type | Spherical | Spherical | Spherical | |
| Filler cut size | µm | 75 | 75 | 75 |
| Gel time (175°C) | s | 30 | 30 | 31 |
| Spiral flow (175°C) | inch | 42 | 50 | 38 |
| Tg by TMA | °C | 115 | 112 | - |
| CTE 1 (TMA) | ppm/°C | 9 | 9 | - |
| CTE 2 (TMA) | ppm/°C | 37 | 34 | - |
| Modulus at RT (DMA) | MPa | 28176 | 26451 | 26557 |
| Modulus at 175°C (DMA) | MPa | 752 | 620 | 523 |
| Modulus at 260°C (DMA) | MPa | 637 | 541 | 440 |
| Moisture absorption (PCT 24 hrs) | % | 0.20 | 0.25 | 0.25 |
| Flexural strength at 25°C | MPa | 150 | 140 | 142 |
| Flexural modulus at 25°C | MPa | 24489 | 23003 | 24300 |
| Flammability (UL94, 1/8") | Rating | V-0 | V-0 | V-0 |
| Volume resistivity | ×10¹⁵ Ω·cm | 65 | 70 | 50 |
| Comparative Tracking Index (CTI) | V | 575 | 600 | 575 |
Data contained herein may vary and are intended for reference only. Please refer to Technical Data Sheets for accurate values.
This table summarizes key processing, mechanical, thermal, and electrical properties for the HYSOL GR710F epoxy molding compound family (GR710F, GR710F GN, and GR710F GN26).
GR710F, GR710F GN, and GR710F GN26 share the same MAR+LMW epoxy system, spherical filler with a 75 µm cut, and UL94 V-0 flammability, but they differentiate in flow and stiffness retention, which drives where each grade fits best in molding. GR710F GN is the highest flow option at 175°C (50 in) while retaining strong mechanical performance (DMA modulus 26451 MPa at RT, 620 MPa at 175°C) and the highest electrical robustness in this set (volume resistivity 70 ×10^15 Ω·cm, CTI 600 V), making it the best default for complex mold filling or longer flow length designs where you still want stronger dielectric margin. GR710F is the stiffest overall (highest DMA modulus at RT and at temperature, and higher Tg and slightly higher CTE2 than GN), which generally favors packages where dimensional stability and warpage control are priority and the required flow length is moderate (spiral flow 42 in). GR710F GN26 trades flow (38 in) and high temperature modulus (lowest modulus at 175°C and 260°C) for the lowest filler content, which can be a practical choice when reduced compound stiffness helps relieve stress in more fragile packages or layouts sensitive to stress transfer, but it comes with lower electrical resistivity than GN and is less suited when maximum flow or dielectric margin is the primary requirement.
