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- Hysol GR910-K | Black Epoxy Mold Compound
Hysol GR910-K | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Halogen free
- High fluidity to avoid W/S issue
- Designed for BGA/LGA
Product Description
Hysol GR910 K is a black epoxy molding compound specifically designed for Memory Ball Grid Arrays (BGA) and Land Grid Arrays (LGA). This semiconductor-grade material features spherical silica filler with a cut size of 53 µm, delivering exceptional fluidity and low shrinkage, which aids in advanced warpage control during manufacturing.
Hysol GR910 K is halogen-free and environmentally friendly, ensuring compliance with stringent safety standards. It offers excellent electrical performance, meeting the UL 94 V-0 flammability standard at a thickness of 1/8 inch.
Available Versions:
- GR910 K | Optimized for high Tg and low modulus applications
- GR910 K-31 | Tailored for high Tg and low shrinkage requirements
Key Features:
- High Thermal Stability | Glass transition temperatures of 155°C (GR910 K) and 153°C (GR910 K-31)
- Excellent Flowability | Ensures uniform coverage and filling during the molding process
- Low Mold Shrinkage | 0.22% for GR910 K and 0.19% for GR910 K-31, contributing to precise dimensions
- Low Coefficient of Thermal Expansion (CTE) | Minimizing stress during thermal cycling
- Low Water Absorption | Less than 0.35%, enhancing reliability in humid environments
Highly Recommended For:
- Advanced semiconductor packaging in high-performance applications
- Memory devices requiring robust mechanical and thermal properties
- Environmentally conscious projects where halogen-free materials are a must
Technical Specifications
| General Properties | |||||||||
| Color Color The color | Black | ||||||||
| Filler Content | 86.5 % | ||||||||
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.97 | ||||||||
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| Thermal Properties | |||||||||
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 155 °C | ||||||||
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 0.9 W/m.K | ||||||||
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| Electrical Properties | |||||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 4.0x1016 Ohms⋅cm | ||||||||
| Mechanical Properties | |||||||||
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| Chemical Properties | |||||||||
| Moisture absorption | 0.35 % | ||||||||
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| Curing Conditions | |||||||||
| Transfer Pressure | 40 – 85 kg/cm2 | ||||||||
| Transfer Time | 8 – 15 s | ||||||||
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| Physical Properties | |||||||||
| Spiral Flow @ 175°C | 200 cm | ||||||||
Additional Information
| PROPERTY | UNIT | GR910 K | GR910 K-31 |
| Filler Content | % | 86.5 | 89 |
| Filler Cut | um | 53 | 53 |
| Filler Shape | - | Spherical | Spherical |
| Specific Gravity | - | 1.97 | 2.01 |
| Spiral Flow | cm | 200 | 172 |
| Hot Plate Gel Time | sec | 43 | 49 |
| Glass Transition Temperature | °C | 155 | 153 |
CTE by TMA, α1 CTE by TMA, α2 | ppm ppm | 10 37 | 9 32 |
Water Absorption (PCT24h) | wt% | 0.35 | 0.33 |
Flexural Strength @25°C Flexural Modulus @25°C | MPa Gpa | 141 19.8 | 145 24.5 |
Mold Shrinkage (After PMC) | % | 0.22 | 0.19 |
Cl- | ppm | 7 | 10 |
| pH | - | 6.1 | 6.0 |
| MSL Capability | - | MSL 2 | MSL 3 |
| Feature | High Tg Good Flowability Low Modulus | High Tg Low Shrinkage Low CTE |
