Hysol MG33F-0659 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Automold Tantalum capacitors
  • Low moisture absorption
  • High moldability and fast cycle time

Product Description

Hysol MG33F-0659 is a black, semiconductor-grade epoxy molding compound (duroplast) designed for the encapsulation and protection of tantalum capacitors and surface mount resistors. Because of its fast cure, it is also very well suited for the manufacture of reed relays. 

Hysol MG33F-0659 has a filler weight of 75% and is formulated with a short gel time to make it useful for the production of (Ta) Tantalum capacitors through automolding processes. It is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and meets UL 94 V-0 Flammability at 6.35mm thickness.

Typical applications:

Features:

  • Fast cured formulation (Check the curing conditions)
  • Long spiral flow to provide best moldability and wide molding latitude
  • Great adhesion to copper substrates and CTE matched with Al
  • High thermal stability (High Tg and low stress )
  • Low mold shrinkage (0.16%) for large components molding

 

Product Family
MG33F-0659  
Pellet
14 mm
6.1 gr
15 kg

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Black
Filler Content 76 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.83
Shelf Life
Shelf Life @ 5°C 210 days
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 3.0x1015 Ohms⋅cm
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 14710 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 137 N/mm2
Hardness
Hot Hardness, Shore D @ 175°C 85
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 175 °C
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V0
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 18 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 60 ppm/°C
Gel Time
Gel Time @ 175°C / 347°F 14 s
Chemical Properties
Moisture absorption 0.45 %
Curing Conditions
Transfer Pressure 40 - 85 kg/cm2
Transfer Time 6 - 15 s
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 2 - 6 hrs
Curing Schedule
Curing Time @ 175°C / 347°F (Automold) 50 - 70 s
Curing Time @ 175°C / 347°F (Conventional Mold) 70 - 90 s
Mold Temperature 140 - 180 °C
Preheat Temperature 80 - 95 °C
Physical Properties
Spiral Flow @ 175°C 66.04 cm

Additional Information

MG33F-0659 Epoxy Mold Compound for Aluminum Housed Resistors

Hysol MG33F-0659 is formulated based on MG33-0690, which is a industrial proven product for aluminum housed resistors encapsulation. They have pretty similar properties. You could check the properties comparison table below. Two extra advantages of MG33F-0659 are:

  • (1) MG33F-0659 contains green flame retardants and meet UL90 V-0 flammability @1/4 inches, which MG33-0690 does not have.
  • (2) MG33F-0659 has lower mold shrinkage than MG33-0690.

In conclusion, Hysol MG33F-0659 is a good alternative to MG33-0690 for aluminum housed resistor application.