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- Hysol MG33F-0660 | Gold Epoxy Mold Compound
Hysol MG33F-0660 | Gold Epoxy Mold Compound
Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Green molding compound
- Very low moisture absorption
- Gold version of MG33F-0659
Product Description
Hysol MG33F-0660 is the gold version of MG33F-0659. It is a semiconductor-grade epoxy molding compound or duroplast designed for the encapsulation and protection of tantalum capacitors. Because of its fast cure, it is also very well suited for the manufacture of tantalum capacitors and reed relays.
Hysol MG33F-0660 was formulated with a short gel time to make it useful for automolding passive components such as tantalum capacitors and reed relays. It is an environmentally friendly, halogen free, "green" molding compound which contains no bromine, antimony or phosphorus flame retardant. MG33F-0660 molding compound was developed specifically for the encapsulation of tantalum capacitors in automold applications. MG33F-0660 meets UL 94 V-0 Flammability at 6.35mm thickness.
Technical Specifications
| General Properties | |||||||||||
| Color Color The color | Gold | ||||||||||
| Filler Content | 76 % | ||||||||||
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.83 | ||||||||||
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| Thermal Properties | |||||||||||
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 175 °C | ||||||||||
| UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole | V0 | ||||||||||
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| Electrical Properties | |||||||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 3.0x1015 Ohms⋅cm | ||||||||||
| Mechanical Properties | |||||||||||
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| Chemical Properties | |||||||||||
| Moisture absorption | 0.45 % | ||||||||||
| Physical Properties | |||||||||||
| Spiral Flow @ 175°C | 66 cm | ||||||||||
| Curing Conditions | |||||||||||
| Transfer Pressure | 40 - 85 kg/cm2 | ||||||||||
| Transfer Time | 6 - 15 s | ||||||||||
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