- Home
- Products
- Molding Compounds
- Semiconductor Epoxy Mold Compounds
- Hysol MG40FS | Black Epoxy Mold Compound
Hysol MG40FS | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Designed for PDIP packages
- Excellent HTRB performance
- Ideal for high voltage discrete semiconductors
Product Description
Hysol MG40FS is a high productivity molding compound designed specifically for high volume encapsulation of PDIP, SOIC, Power discrete and High Voltage devices. This material is applicable for devices having chip dimensions up to 150 mils square. It has been formulated to provide the best possible moldability and as wide molding latitude as possible
Hysol MG40FS has excellent high temperature electrical stability. This makes it ideal for PDIP, TO220, TO247 and high voltage discrete semiconductor packages that need to resist higher temperatures. This product is available in both conventional (MG40FS) and automold (MG40FS-AM) versions.
Technical Specifications
| General Properties | |||||||||
| Color Color The color | Black | ||||||||
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.84 | ||||||||
| |||||||||
| Electrical Properties | |||||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 1.0x1016 Ohms⋅cm | ||||||||
| |||||||||
| Chemical Properties | |||||||||
| Moisture absorption | 0.85 % | ||||||||
| |||||||||
| Physical Properties | |||||||||
| Spiral Flow @ 175°C | 89 cm | ||||||||
| Thermal Properties | |||||||||
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 160 °C | ||||||||
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 0.95 W/m.K | ||||||||
| UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole | V0 | ||||||||
| |||||||||
| |||||||||
| Mechanical Properties | |||||||||
| Molded Shrinkage | 0.5 % | ||||||||
| |||||||||
| |||||||||
| |||||||||
| Curing Conditions | |||||||||
| Transfer Pressure | 40 - 100 kg/cm2 | ||||||||
| Transfer Time | 15 - 25 s | ||||||||
| |||||||||
| |||||||||