KESTER 959T Soldering Flux

Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)

Main features

Excellent wetting
Low rosin content
Non-corrosive

Product Description

KESTER 959T is a no-clean, non-corrosive liquid flux formulated for wave soldering of both conventional and surface mount circuit board assemblies. Formulated to reduce micro-solderball formation, 959T liquid flux delivers superior soldering performance and cosmetic results.

Product Key Features

Excellent wetting for high quality solder joints.
Low rosin content (0.5%), improving solderability, heat stability, and and high surface insulation resistance.
Non-corrosive
Even residue distribution

Applications

Wave soldering of conventional through-hole assemblies & surface mount technology (SMT) boards.

Specifications
Additional Information

Technical Specifications

General Properties
Solids	2.9 %
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.	0.794
Thermal Properties
Flash Point Flash Point The flashpoint of a solvent is the lowest possible temperature at which it can vaporize to form an ignitable vapor. Flashpoint is often confused with “autoignition temperature”, which is the temperature at which a solvent ignites without an ignition source.	18 °C

Additional Information

Flux Application

959T can be applied to circuit boards by a spray, foam, or dip process. Flux deposition should be 120 to 240ug of solids/cm² (750 to 1500 ug/in²). An air knife after the flux tank is recommended to remove excess flux from the circuit board and prevent dripping on the preheated surface.