KESTER EM808 Solder Paste

Harmonization Code : 3810.10.00 |   Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
  • Excellent solderability
  • Print speed up to 150 mm/sec
  • Excellent anti-slumping features

Product Description

KESTER EM808 is a lead-free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, EM808 provides hours of stable stencil life, tack time and repeatable brick definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the EM808 is very aggressive and  provides superior wetting to OSP coated and Immersion silver boards.

Product Key Features

  • Outstanding batch-to-batch consistency.
  • Lead-free
  • water-soluble formulation
  • Excellent anti-slumping characteristics

Applications

  • Stencil printing and enclosed head printing (88% metal)
Product Family
AP-EM808  
SAC305 Sn96Ag4
1kg Unit | China 1kg Unit

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TDS, SDS & Technical documents

Technical Specifications

Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 1800000 mPa.s

Additional Information

Reflow Profile

The recommended reflow profile for EM808 made with SAC alloys is shown here. This profile is simply a guideline. Since EM808 is a highly active solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board and mix of defects. Please contact MacDermid Alpha Technical Support if you need additional profiling advice.

Ramp Rate:

  • ≤ 3 °C/sec

Preheat Zone:

  • Temperature: 80–150 °C
  • Duration: 40–60 seconds typical

Soak Zone:

  • Temperature: 150–190 °C
  • Duration: 60–120 seconds typical

Reflow Zone:

  • Peak Temperature: 235 °C (±5 °C)
  • Time above liquidus: 40–80 seconds typical

Total Profile Length:

  • Approximately 3–5 minutes