KESTER EM828 Solder Paste

Harmonization Code : 3810.10.00 |   Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
  • Low-voiding
  • Excellent wetting
  • Long stencil life

Product Description

Kester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. It is breakthrough in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning.  Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. KESTER EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.

Product Key Features

  • Low-voiding underneath area array components
  • Excellent wetting on a variety of metalizations
  • Long stencil life and tack time
  • Print speed up to 150mm/second (6 inch/second)

Applications

  • Stencil and enclosed head printing (89.5% metal)

Note: Due to changes in REACH Regulations, this product is no longer sold into Europe or to European customers.

Product Family
AP-EM828  
1kg Unit

Catalog Product

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TDS, SDS & Technical documents

Technical Specifications

Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 1700000 mPa.s

Additional Information

Reflow Profile

The recommended reflow profile for EM828 made with SAC alloys is shown here. This profile is simply a guideline. Since EM828 is a highly active solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board, and mix of defects. Please contact Technical Support if you need profiling advice.

Preheat Zone:

  • Duration: 45–90 seconds
  • Temperature ramp up from ~25°C to ~150°C
  • Average Ramp Rate: 1–2°C/sec

Soak Zone:

  • Duration: 60–120 seconds
  • Temperature range: ~150°C to ~200°C

Reflow Zone:

  • Duration: 45–90 seconds
  • Peak Temperature: 235–250°C

Total Profile Length: 3–5 minutes.