KESTER NP505-HR Solder Paste

Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials

Main features

High reliability
Exceptional print performance
Zero-halogen formula

Product Description

KESTER NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR testing. NP505-HR can handle a wide variety of printer variables, including print speed and long idle times with a wide range of temperatures and humidities. NP505-HR is fully capable of printing and reflowing 01005 components in air reflow with minimal graping behavior. Post-soldering, NP505-HR offers minimized defects, including head-in-pillow and QFN/BGA voiding. This paste is zero-halogen, exceeding the IPC definition for halogen-free. NP505-HR is classified as ROL0 per IPC J-STD-004B. NP505-HR is part of Kester’s high reliability product line and compatible with no-clean RF550 Rework Flux, NF372-TB Solder Flux and SELECT-10™ Selective Soldering Flux.

Product Key Features

Exceeds IPC standards for halogen-free materials
Designed to maintain reliability even under harsh damp cycling SIR (Surface Insulation Resistance) testing.
Supports printing and reflowing of 01005 components with minimal graping in air reflow environments.
Minimizes common soldering defects such as head-in-pillow & QFN/BGA voiding
Classified as ROL0 per IPC J-STD-004B

Applications

Solder printing
Fully compatible with:
- RF550 Rework Flux
- NF372-TB Solder Flux
- SELECT-10™ Selective Soldering Flux

Specifications
Additional Information

Technical Specifications

Physical Properties
Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application	1750000 mPa.s

Additional Information

NP505-HR Reflow Profile

The general recommended convection reflow profile for NP505-HR formula made with SAC and Innolot alloys is shown here as a starting point. Your final profile will depend on your board mass and component combination. NP505-HR has excellent solderability and wetting capabilities in air or nitrogen reflow atmospheres. Your optimal profile may be different from the basic graph.

Please contact us if you need profiling advice.