KESTER R520A Solder Paste

Harmonization Code : 3810.10.00 |   Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
  • Pb-free
  • Stable tack life
  • Consistent printing

Product Description

KESTER R520A is a lead-free, organic acid, water-soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards. R520A is an extremely stable water-soluble formula.

Product Key Features

  • Lead-free & water-soluble
  • Print speed up to 150mm/sec (6in/sec)
  • Stable tack life to long stencil life
  • Consistent printing

Applications

  • Stencil & enclosed head printing (89.5% metal)
Product Family
AP-R520A  
SAC305
T3
1kg Unit

Catalog Product

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Shipping in 6 weeks

Technical Specifications

Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
2150000 mPa.s

Additional Information

Reflow Profile

The recommended reflow profile for R520A made with SAC alloys is shown here. This profile is simply a guideline. Since R520A is a highly active solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board, and mix of defects. Please contact us if you need additional profiling advice.

Peak Temp: 235–255 °C

Zones:

  • Pre-heating Zone: 2.0–4.0 min max
  • Soaking Zone: 2.0 min max, 60–90 sec typical

Reflow Zone: time above 217 °C (90 sec max), 60–75 sec typical

Ramp-up: <2.0 °C/sec