KESTER R562 Solder Paste

Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials

Main features

Reduces BGA voiding
12-hour stencil life
Consistent printing

Product Description

KESTER R562 is an organic acid, water-soluble solder paste specifically designed for resistance to environmental extremes. Water-soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. R562 will maintain its print characteristics, tack and activity even after exposure to environmental extremes.

Product Key Features

Reduces BGA voiding
12-hour stencil life
Print speeds up to 6 in/sec
Consistent printing

Applications

Stencil printing & enclosed head printing (90% metal)

Specifications
Additional Information

Technical Specifications

Physical Properties
Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application	1750000 mPa.s

Additional Information

Reflow Profile

The recommended reflow profile for R562 made with either the Sn63Pb37 or Sn62Pb36Ag02 is shown here. This profile is simply a guideline. Since R562 is a highly active solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board and mix of defects. Please contact us if you need additional profiling advice.

Peak Temp: 219–230 °C

Zones: