Kester TSF-6502JCR

Harmonization Code : 29051200 |   Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
  • 8-hour stencil life
  • Printing up to <16mil pitch
  • ROL1 & Bellcore GR-78 compliant

Product Description

Kester TSF-6502JCR is a no-clean tacky soldering flux formulated for high activity and robust performance. TSF-6502JCR enables excellent soldering on challenging surfaces, even under multiple thermal cycles, while leaving clear, aesthetically pleasing residues.

Product Key Features

  • Stencil life: 8 hours (process dependent) 
  • Excellent printing characteristics to <16mil pitch 
  • Leaves bright/shiny solder joints after reflow 
  • Can reflow in air or nitrogen environments 
  • Classified as ROL1 per J-STD-004 
  • Compliant to Bellcore GR-78

Applications

  • Nickel Surface Soldering
  • OSP-Treated Copper Boards
  • Multi-Reflow Processes
Product Family
AP-TSF6502JCR  
30g Syringe

Catalog Product

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Technical Specifications

Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
100000 mPa.s

Additional Information

Recommended Reflow Profile

Optimal activation temperatures are 150 to 210 °C (302 to 410 °F). See the Soak Zone in diagram below:

Reflow Profile

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