LINQBOND DA-8060S | Sintering Die-Attach

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • PFAS free
  • Low Resin Bleed-Out (RBO)
  • High thermal conductivity and adhesion to various leadframes

Product Description

LINQBOND DA-8060S is a single-component, pressure-less silver sintering die attach adhesive, known for its exceptional adhesion, high thermal conductivity, and high reliability. It performs excellently with various leadframes types, including Ag-spot plated, bare copper, PPF, and ceramic. Additionally, LINQBOND DA-8060S boasts exceptional workability and low Resin bleed out properties, making it ideal for high-volume semiconductor packaging applications.

LINQBOND DA-8060S is typically used as die attach for  high power applications such as 5G, EVs, Industrial , Consumer electronics, Telecommunications, Aerospace, Defense and semiconductor packages such as SIP, QFN, LGA and HBLED.

 

Cure Schedule

  • Ramp to 130°C and hold for 30 min + ramp to 220°C and hold for 90 min

    • Ramp rate 5°C/min

Product Family
DA-8060S  
30cc EFD syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
No longer available No longer available No longer available
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Filler Content 85 %
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
 24 hours
Shelf Life
Shelf Life @ -40°C 365 days
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 2.5x10-5 Ohms⋅cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 165 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 120 W/m.K
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 37 ppm/°C
Mechanical Properties
Shear strength
Shear Strength @250°C 7.5 N/mm2
Shear Strength @25°C 8.3 N/mm2
Tensile Modulus
Tensile Modulus @250°C 12000 N/mm2
Tensile Modulus @25°C 8000 N/mm2
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 5.8
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
 12000 mPa.s