LINQSOL EMC-9012H | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-9012H | Black Epoxy Mold Compound

Main features

Green epoxy molding compound
Designed for Ball Grid Array (BGA) packages and Quad Flat No Leads (QFN) Packages
High glass transition temperature, low stress, and excellent reliability performance

Product Description

LINQSOL™ EMC-9012H is a green epoxy molding compound specifically developed for the encapsulation of Ball Grid Array (BGA) and Quad Flat No Leads (QFN) packages. Its long spiral flow at 175 °C satisfies the moldability requirement for BGA and QFN molding.

LINQSOL™ EMC-9012H has a high glass transition temperature designed to pass higher reliability requirements. Additionally, with a UL 94 V-0 flammability rating and ultra-low water absorption, EMC-9012H guarantees excellent performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH.

Overall, LINQSOL™ EMC-9012H seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

Key Features

Long spiral flow (165 cm @ 175 °C) — Reliable fill of fine-pitch BGA/QFN with fewer voids and shorts.
High Tg (158 °C) — Better margin through reflow and high-temp operation.
Low moisture (0.36% @ boiling) — Reduces popcorn and delamination risk.
Low ionic residue (Cl⁻ 7 ppm, Na⁺ 4 ppm) — Minimizes corrosion/CAF for long-term reliability.
Controlled CTE (10/40 ppm/°C) — Helps limit warpage and die/package stress.
UL-94 V-0 — Meets stringent safety requirements.
Low mold shrinkage (0.16%) — Dimensional stability for tight tolerances.
Green, RoHS & REACH compliant — Halogen-free formulation aligned with global regulations.

Application/Suitable For:

BGA (standard and fine-pitch), QFN (thin-profile, fine-pitch) transfer molding
High-cavitation molds requiring fast, balanced flow and consistent gate-to-gate fill
Packages targeting low warpage, reflow survivability, and high reliability (consumer, industrial, networking, storage)

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

87 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.99

Shelf Life
Shelf Life @ 5°C	6 days

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

158 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	10 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	40 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	40 s

Electrical Properties

Water Extract Data
Conductivity	30 mmhos/cm

Chemical Properties

Moisture absorption

0.36 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	7 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	4 ppm

Physical Properties

Spiral Flow @ 175°C

165 cm

Mechanical Properties

Molded Shrinkage

0.16 %

Water Extract Data
pH of extract	5.5

Flexural Modulus
Flexural Modulus @ 25°C	21.2 N/mm2
Flexural Modulus @ 260°C Flexural Modulus @ 260°C Flexural Modulus taken at 260°C	0.8 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	170 N/mm2
Flexural Strength @ 260°C Flexural Strength @ 260°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 260°C	31 N/mm2

Curing Conditions

Transfer Pressure

40-90 kg/cm2

Transfer Time

10-25 s

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	4-8 hrs

Curing Schedule
Curing Time @ 175°C / 347°F	100-150 s
Mold Temperature	170-180 °C

Additional Information

LINQSOL EMC-9012 Series Product Property Comparison

PROPERTY	UNIT	EMC-9012	EMC-9012H
Color	–	Black	Black
Filler content	%	89	87
Filler cut size	µm	55	53
Specific gravity	–	2.01	1.99
Spiral flow at 175 °C	cm	165	165
Ion content Chloride (Cl–) concentration Sodium (Na+) concentration	ppm ppm	7 6	7 4


Electrical conductivity of extract	µS⋅cm–1	31	30
Flexural strength	MPa	145	170
Flexural modulus	GPa	24	21.2
Adhesion Strength to Cu at RT Before MSL3 Preconditioning After MSL3 Preconditioning	MPa MPa	6.5 6.4	- -
Glass transition temperature	°C	133	158
Coefficient of thermal expansion, α1	ppm/K	8	10
Coefficient of thermal expansion, α2	ppm/K	35	40
Gel time at 175 °C	sec	45	40
Flammability	UL-94	V-0	V-0

LINQSOL EMC-9012H Storage and Handling

LINQSOL EMC-9012H is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.