LINQSOL EMC-9023 | Epoxy Mold Underfill

Harmonization Code : 3907300090 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms

Main features

Green epoxy molding compound
Epoxy mold undefill
Designed for FCBGA, FCCSP, SiP

Product Description

LINQSOL EMC-9023 series is a molded underfill (MUF) epoxy molding compound specifically developed for the encapsulation of flip chip ball grid arrays (FCBGA), flip chip chip scale packages (FCCSP), and system in packages (SiP). LINQSOL EMC-9023 has excellent flowability and low modulus that meets low-stress requirements. Additionally, with a UL 94 V-0 flammability rating and low ionic contents.

EMC-9023 guarantees good moldability and outstanding reliability performance. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL EMC-9023 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

Available Version

EMC-9023 Standard
EMC-9023K (Improved moisture resistance)
EMC-9023E (Low-stress epoxy mold underfill)

Product Family
EMC-9023

1. Select Product Form

Pellet

2. Available Pellet Size

14 mm

3. Available Pellet Weight

4.2 gr

4. Available Package Size

15 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

85 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.96

Shelf Life
Shelf Life @ 5°C	183 days

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

162 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	13 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	47 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	60 s

Electrical Properties

Water Extract Data
Conductivity	4 mmhos/cm

Chemical Properties

Moisture absorption

0.38 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	7 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	6 ppm

Physical Properties

Spiral Flow @ 175°C

180 cm

Mechanical Properties

Water Extract Data
pH of extract	5.0

Flexural Modulus
Flexural Modulus @ 25°C	23.6 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	150 N/mm2

Curing Conditions

Transfer Pressure

70-150 kg/cm2

Transfer Time

10-25 s

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	6-12 hrs

Curing Schedule
Curing Time @ 175°C / 347°F	100-120 s
Mold Temperature	170-180 °C

Additional Information

LINQSOL EMC-9023 Epoxy Mold Underfill Series

To simplify die-to-substrate connection and multilayer substrate or laminate, epoxy mold underfill is essential- combining underfill and over-molding the packages into one.

LINQSOL EMC-9023

Standard epoxy mold underfill.

LINQSOL EMC-9023K

Improved Moisture Resistance

LINQSOL EMC-9023E

Low-stress epoxy mold underfill

Property	Unit	EMC-9023	EMC-9023K	EMC-9023E
General Properties
Filler content	%	85	85	85
Filler sieving size	µm	20	20	20
Specific gravity	-	1.96	1.96	1.96
Spiral flow at 175°C	cm	180	165	190
Chemical Properties
Ion content - Chloride (Cl–)	ppm	7	3	7
Ion content - Sodium (Na+)	ppm	6	5	4
Water absorption (PCT 24hr)	%	0.38	0.3	0.35
pH of extract	-	5.0	6.0	5.0
Electrical conductivity of extract	µS⋅cm–1	40	15	30
Mechanical Properties
Flexural strength (25°C / 260°C)	MPa	150 / 25	145/23	145 / 21
Flexural modulus (25°C / 260°C)	GPa	23.6 / 11	21/0.9	23.6 / 9.8
Mold shrinkage	%	0.24	0.23	0.27
Thermal Properties
Glass transition temperature	°C	162	150	150
Coefficient of thermal expansion, α1	ppm/°C	13	11	11
Coefficient of thermal expansion, α2	ppm/°C	47	46	43
Gel time at 175°C	sec	60	52	56
Flammability	UL-94	V-0	V-0	V-0

LINQSOL EMC-9023K Adhesion on Cu/Ag Substrate through Tab Pull Test

Property	Unit	EMC-9023K
Adhesion to Cu after Post-Mold Cure	MPA	5
Adhesion to Ag after Post-Mold Cure	MPA	6
Adhesion to Cu after MSL 3 Pre-conditioning	MPA	4
Adhesion to Ag after MSL 3 Pre-conditioning	MPA	6

Processing Instructions

Before use, let LINQSOL EMC-9023 compounds reach room temperature (23±5 °C) for 16 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
Use the materials within 24 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-9023 series is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5°C is 183 days.

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.