LINQSOL EMC-9131 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-9131 | Black Epoxy Mold Compound

Main features

High Spiral flow
Designed for SOT and Modules
Low stress and Low Moisture Absorption

Product Description

LINQSOL EMC-9131 is a high-performance, eco-friendly epoxy molding compound engineered specifically for BGA and CSP encapsulation. Designed to minimize warpage, EMC-9131 features an ultra-low modulus and optimized linear shrinkage, ensuring reliable package integrity.

LINQSOL EMC-9131 its exceptional fluidity reduces wire sweep, even for fine-pitch packages and ultra-thin bonding wires. EMC-9131 also demonstrates outstanding adhesion to both PCB substrates and silicone chips, performing reliably in rigorous tests up to MSL2 @260°C. This versatile compound is compatible with a range of BGA, CSP, and QFN package types, including PBGA, LGA, FBGA, CABGA, CTBGA, FCBGA, FC-CSP, QFN, DFN, and more.

Product Family
EMC-9131

1. Select Package Type

10kg box

2. Available Product Form

Pellet

3. Available Pellet Size

16 mm

4. Available Pellet Weight

8.4 gr

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 16 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

89 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.01

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

130 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	30 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	30 s

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	26 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	160 N/mm2

Hardness
Hot Hardness, Shore D @ 175°C	82

Chemical Properties

Moisture absorption

0.15 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	13.5 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	3 ppm