LINQSOL EMC-G833 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 |   Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
  • Green epoxy molding compound
  • Designed for Quad Flat No Leads(QFN), Quad Flat (QFP) packages and DFN Packages
  • Excellent reliability performance

Product Description

LINQSOL EMC-G833  is a green epoxy molding compound specifically developed for the encapsulation of Quad Flat No Leads(QFN), Quad Flat (QFP) packages and other surface mount packages. Its wide gel time provides a better processing window, required for QFN, DFN nd QFP molding.  

LINQSOL EMC-G833 has a high spiral flow that meets higher flowability requirements. Additionally, with a UL 94 V-0 flammability rating and ultra-low water absorption, EMC-G833  guarantees excellent performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH.  

Overall, LINQSOL EMC-G833  seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

 

Available Variants

  • LINQSOL EMC-G833  Standard Epoxy Mold compound for MSL 3 QFN, DFN and QFP. 
  • LINQSOL EMC-G833R MSL 1 Capable

 

Reliability Tests Passed:

  • Preconditioning: 30°C, 60% RH
  • u-HAST: T=130°C, RH= 85%, P= 230kPa
  • PCT, Tₐ=121°C, P=205 kPa, RH=100%* 168 hours
  • TCT, –65 to 150 °C * 1000 cycles
  • HTST, T=150°C  * 1000 hours
Product Family
EMC-G833  
Pellet
16 mm
8 gr

Catalog Product

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Technical Specifications

General Properties
Color
Color
The color
Black
Filler Content 87 %
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.97
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
112 °C
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V-0
Physical Properties
Spiral Flow @ 175°C 165 cm
Curing Conditions
Transfer Pressure 70-150 kg/cm2
Transfer Time 8-25 s

Additional Information

 

LINQSOL EMC-G833 Series Product Property Comparison

 
PROPERTY UNIT EMC-G833 EMC-G833R

Color

Black

Black

Filler content

%

87

88

Filler cut size

µm

75

75

Specific gravity

1.97

2.0

Spiral flow at 175 °C

cm

165

150

Ion content

Chloride (Cl) concentration

Sodium (Na+) concentration


ppm

ppm


7

6

5

5

Electrical conductivity of extract

µS⋅cm–1

50

30

Flexural strength

MPa

145

162

Flexural modulus

GPa

22.8

24

Glass transition temperature

°C

112

118

Coefficient of thermal expansion, α1

ppm/K

11

10

Coefficient of thermal expansion, α2

ppm/K

36

36

Gel time at 175 °C

sec

57

52

Flammability

UL-94

V-0

V-0

 

 

LINQSOL EMC-G833 Storage and Handling

LINQSOL EMC-G833 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.

 

Presentations

Ball Grid Array and Land Grid Array Packages

The presentation above shows the materials used for Ball Grid Array and Land Grid Array Packages.

Quad Flat No Lead and Dual Flat No Lead Packages

The presentation above shows the materials used for Quad Flat No Lead and Dual Flat No Lead Packages.

EMC-G833 MSL 3 Reliability Test Data

This presentation summarizes the reliability performance of EMC-G833 under MSL 3 test conditions.

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