LINQSOL EMC-G833R | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

LINQSOL EMC-G833R | Black Epoxy Mold Compound

Main features

Green epoxy molding compound
Designed for Quad Flat No Leads(QFN) and Quad Flat (QFP) packages
Excellent reliability performance (MSL 1)

Product Description

LINQSOL™ EMC-G833R is a black, halogen-free (“green”) epoxy molding compound engineered for QFN, QFP, and other SMD packages. A long gel time (~52 s @ 175 °C) pairs with high spiral flow (~150 cm @ 175 °C) to deliver a generous processing window—ideal for thin runners, complex gate designs, and high-cavity tools typical of QFN/QFP molding. The compound’s low moisture uptake (~0.28% PCT-24 h) and very low ionic extractables (Cl⁻/Na⁺ ≈ 5 ppm) support MSL 1 capability, while UL-94 V-0 helps meet safety and compliance needs.

With a low CTE (α1 ≈ 10 ppm/°C, α2 ≈ 36 ppm/°C), low mold shrinkage (~0.15%), and balanced mechanicals (≈162 MPa flexural strength; ≈24 GPa modulus at 25 °C), EMC-G833R maintains dimensional control and package reliability through assembly and reflow. Recommended molding parameters (170–180 °C; 8–25 s transfer; 100–180 s cure @ 175 °C; post-mold cure 4–8 h @ 175 °C) fit standard transfer molding lines. Formulated RoHS & REACH compliant, EMC-G833R brings a dependable blend of throughput, yield, and long-term performance. EMC-G833R guarantees excellent performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH.

Overall, LINQSOL EMC-G833R seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

Key Features

High spiral flow (~150 cm @ 175 °C) — Fills fine-pitch and thin-gate QFN/QFP tools cleanly to reduce short-shots and voids.
Long gel time (~52 s @ 175 °C) — Wide process latitude for complex runners and multi-cavity molds; easier parameter tuning.
MSL 1 capable — Supports robust board-level reliability and simplified dry-pack handling.
Ultra-low moisture & ions — ~0.28% (PCT-24 h) and Cl⁻/Na⁺ ≈ 5 ppm each help minimize popcorn, CAF, and leakage risk.
Low CTE & shrinkage — α1 ≈ 10 ppm/°C, α2 ≈ 36 ppm/°C, shrinkage ~0.15% for coplanarity and warpage control.
UL-94 V-0 — Meets stringent flammability requirements for safety-critical designs.
Halogen-free (“Green”) — RoHS & REACH compliant formulation for global compliance.

Application Suitable for

QFN families: QFN, DFN, MLF, QFNs with exposed pad / thermal slug
QFP families: LQFP, TQFP, PQFP, thin-pack QFP variants
Other SMD packages: SOP/SSOP/TSSOP/MSOP, small discretes requiring high flow and low warpage
Use cases: High-cavity, fine-pitch transfer molding; assemblies needing MSL 1, low warpage, and UL-94 V-0 compliance

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

88 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

2.0

Shelf Life
Shelf Life @ 5°C	183 days

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

118 °C

UL 94 Rating

UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole

V-0

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	10 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	36 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	52 s

Electrical Properties

Water Extract Data
Conductivity	30 mmhos/cm

Chemical Properties

Moisture absorption

0.28 %

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	5 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	5 ppm

Physical Properties

Spiral Flow @ 175°C

150 cm

Mechanical Properties

Molded Shrinkage

0.15 %

Water Extract Data
pH of extract	5.0

Flexural Modulus
Flexural Modulus @ 25°C	24 N/mm2
Flexural Modulus @ 260°C Flexural Modulus @ 260°C Flexural Modulus taken at 260°C	18 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	162 N/mm2
Flexural Strength @ 260°C Flexural Strength @ 260°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 260°C	18 N/mm2

Curing Conditions

Transfer Pressure

70-150 kg/cm2

Transfer Time

8-25 s

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	4-8 hrs

Curing Schedule
Curing Time @ 175°C / 347°F	100-180 s
Mold Temperature	180-180 °C

Additional Information

LINQSOL EMC-G833 Series Product Property Comparison

PROPERTY	UNIT	EMC-G833	EMC-G833R
Color	–	Black	Black
Filler content	%	87	88
Filler cut size	µm	75	75
Specific gravity	–	1.97	2.0
Spiral flow at 175 °C	cm	165	150
Ion content Chloride (Cl–) concentration Sodium (Na+) concentration	ppm ppm	7 6	5 5


Electrical conductivity of extract	µS⋅cm–1	50	30
Flexural strength	MPa	145	162
Flexural modulus	GPa	22.8	24
Glass transition temperature	°C	112	118
Coefficient of thermal expansion, α1	ppm/K	11	10
Coefficient of thermal expansion, α2	ppm/K	36	36
Gel time at 175 °C	sec	57	52
Flammability	UL-94	V-0	V-0

LINQSOL EMC-G833R Storage and Handling

LINQSOL EMC-G833R is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.