LOCTITE ABLESTIK 2025DSI

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

Main features

With Spacers
For mother die in array packaging
260ºC reflow capability for Pb-free applications

Product Description

LOCTITE ABLESTIK 2025DSI is a Silica filled die attach adhesive with excellent dispense capabilities, designed for use in array packaging while it can also be used for ASIC attach. Even though its properties are exceptional, Silica has the downside of potentially scratching the dies. That's why manufacturers tend to prefer the QMI range of products for stacking.

LOCTITE ABLESTIK 2025DSI has great adhesion on PPF leadframes, excellent die sheer strength and MSL performance, something that makes it the product of choice for the first (mother) die and a great spacer filled product for laminates. 2025DSIS25 has 25um spacers. It performs excellently for these applications and it compliments nicely the QMI products on die stacking applications. This product has low to medium modulus and can also be used for individual large die.

Cure Schedule

30 minute ramp to 175°C + 15 minutes @ 175°C

Specifications

Technical Specifications

General Properties
Work life @25°C Work life @25°C Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.	24 hours
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.	-34 °C
Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.	0.4 W/m.K
Weight Loss @ 300°C	3.4 %
Physical Properties
Thixotropic index Thixotropic index Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.	5
Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application	11,500 mPa.s