LOCTITE ABLESTIK 561K

Harmonization Code : 3920.99.28.90 |   Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
  • Reworkable
  • Flexible
  • Thermally conductive

Product Description

LOCTITE ABLESTIK 561K is a white epoxy film designed for substrate attach and heat sink bonding. This adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. All data and results will vary with different thicknesses.

LOCTITE ABLESTIK 561K is a reworkable assembly film that passes NASA outgassing standards. If you require a low temperature cure  you can consider LOCTITE ABLESTIK 566K. It is mainly used for substrate attach and heat sink bonding and has a glass fabric carrier.

 

Cure Schedule

  • 30min @150°C
  • 2 hours @ 125°C
Product Family
561K  
12 x 12 inch sheet
0.10 0.125

Catalog Product

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Technical Specifications

General Properties
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
4392 hours
Shelf Life
Shelf Life @ -40°C 365 days
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
55 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.9 W/m.K
Weight Loss @ 300°C 0.34 %
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
85 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
300 ppm/°C
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
9.1x1012 Ohms⋅cm
Dielectric Constant
Dielectric Constant @ 1000 kHz 5.7
Mechanical Properties
Tensile Modulus
Tensile Modulus @-65°C 6,138 N/mm2
Tensile Modulus @150°C 2,000 N/mm2
Tensile Modulus @250°C 1,862 N/mm2
Tensile Modulus @25°C 4,345 N/mm2
Chemical Properties
Moisture absorption 0.9 %
Water Extract pH 8
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
110 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
9 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
35 ppm

Additional Information

How does ABLESTIK 561K compares to ABLESTIK 566K?

The storage temperature of both materials is as low as -40 °C to guarantee its material properties over a longer range of time.
The 561K is a great reference material that can be stored at -40 °C for 12 months but can also be stored at ambient (25 °C) for up to 6 months without loss of performance.
The difference with 561K however, in the higher minimum cure schedule of 125 °C for 2 hours.
The 566K material  can cure at 100 °C but this is achieved by an increased catalyst load making the material more reactive, giving it shorter shelf life. (We would expect -20 °C storage to be sufficient for the 566K for 3-6 months)


Essentially you end up with two options:

  • Use 561K with 6 months storage at 25 °C and accept a higher 125 °C cure
  • Use 566K with 3-6 months storage at -20 °C and cure at 100 °C

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