LOCTITE ABLESTIK 8900NCM

Harmonization Code : 3506.10.00.00 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
  • Low resin bleed
  • Non Conductive
  • No CAT3 CMR substances

Product Description

LOCTITE ABLESTIK 8900NCM epoxy die attach adhesive is specially formulated for small to medium size packages. It is a white, heat curable, non conductive adhesive with low resin bleed and low voiding during the curing process. It has moderate stress absorbing capabilities and can dispense with minimal tailing and stringing.

LOCTITE ABLESTIK 8900NCM is PTFE filled and is suitable for bare, Ag plated and Palladium plated copper leadframes. Actual performance will depend on die size, aspect ratio and package design. This product is a green material, containing no CAT3 CMR substances. It is successfully used in Automotive applications as a low modulus, low stress solution on leadframes and  can also be used for die stacking.

Cure Schedule

  • 30 minute ramp to 175°C + 15 minutes @ 175°C
Product Family
8900NCM  
5cc Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications

General Properties
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
24 hours
Curing Schedule
Cure Type Heat Cure
Shelf Life
Shelf Life @ -40°C 365 days
Thermal Properties
Weight Loss @ 300°C 0.63 %
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
72 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
118 ppm/°C
Mechanical Properties
Tensile Modulus
Tensile Modulus @150°C 35 N/mm2
Tensile Modulus @250°C 42 N/mm2
Tensile Modulus @25°C 680 N/mm2
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
20 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
10 ppm
Physical Properties
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
6
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
10,000 mPa.s

Additional Information

LOCTITE ABLESTIK 8900NC (no M) is better suited for and has been proven to have good adhesion on Gold plated/Au flash substrates.