LOCTITE ABLESTIK ABP 8068TD

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • Good workability
  • ±50 W/mK Thermal Conductivity
  • High electrical conductivity

Product Description

LOCTITE ABLESTIK ABP 8068TD is a semi-sintering die-attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. It is engineered to bond to a variety of die with or without BSM (Back side Metallization).

LOCTITE ABLESTIK ABP 8068TD epoxy-assisted sintering formulation is designed to provide high adhesion, high thermal, and low-stress properties which are essential for the thermal and reliability performances of high-end power packages such as SiP.

Product Family
ABP8068TD  

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
TDS, SDS & Technical documents

Technical Specifications

Additional Information

What are the MSL and Thermal cycling expectations?

ABP 8068TD  has successfully passed MSL3 + 1000 TC (-65/+150C) on PPF QFN device with 3x3mm Ag BSM. As such, we do believe that ABP 8068TD may also pass -40/+125C temp cycling on a larger 4x5mm die size.

For such a larger die size, we do recommend a longer 1hr staging time @ 130°C + minimum 1hr sintering @ 200°C



Cure Schedule


Cure Schedule for Ag, Au and PPF leadframe:
20 minutes ramp to 130°C, hold for 30 minutes, 15 minutes ramp to 200°C, hold for 1 hour in Air or N2

Cure Schedule for Cu leadframe:
20 minutes ramp to 130°C, hold for 30 minutes, 15 minutes ramp to 200°C, hold for 1 hour in N2

Alternate Cure Schedule


Cure Schedule for Ag, Au and PPF leadframe:
20 minutes ramp to 130°C, hold for 30 minutes, 20 minutes ramp to 220°C, hold for 1 hour in Air or N2

Cure Schedule for Cu leadframe:
20 minutes ramp to 130°C, hold for 30 minutes, 20 minutes ramp to 220°C, hold for 1 hour in N2