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- LOCTITE ABLESTIK E 8502-1
LOCTITE ABLESTIK E 8502-1
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- One component
- Low stress
- Thermally conductive
Product Description
LOCTITE ABLESTIK E 8502-1 is a solventless modified epoxy non-conductive adhesive known for its versatility in bonding applications. LOCTITE ABLESTIK E 8502-1 boasts a formulation that combines low-stress properties with strong adhesion capabilities across a wide array of surfaces.
LOCTITE ABLESTIK E 8502-1 flexibility makes it well-suited for scenarios involving disparate coefficients of thermal expansion (CTE), ensuring effective bonding even in mismatched CTE situations.
Technical Specifications
| General Properties | |||||||||
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.15 - 1.2 | ||||||||
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| Thermal Properties | |||||||||
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 60 - 70 °C | ||||||||
| Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system. | 0,6 W/m.K | ||||||||
| Electrical Properties | |||||||||
| Surface Resistivity | 170000000000000 Ohms/sq | ||||||||
| Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface. | 4.1x1013 Ohms⋅cm | ||||||||
| Mechanical Properties | |||||||||
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| Chemical Properties | |||||||||
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| Physical Properties | |||||||||
| Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application | 40000 - 50000 mPa.s | ||||||||
Additional Information
Curing schedule
| Temperature | Cure time |
| 120°C | 90 |
| 150°C | 60 |
| 175°C | 15 |
