LOCTITE ECCOBOND 50400-1

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Low viscosity
  • Low CTE
  • One component

Product Description

LOCTITE® ECCOBOND 50400-1 glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable, low viscosity during use.

LOCTITE® ECCOBOND 50400-1 is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled.

 

Cure Schedule

  • 2 hours @ 150°C

Low Stress Cure Schedule

  • 1 hour @ 120°C + 1 hour @ 150°C
Product Family
50400-1  
30cc Syringe

Catalog Product

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Technical Specifications

General Properties
Pot Life
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
168 hours
Shelf Life
Shelf Life @ -40°C 183 days
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
140 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.63 W/m.K
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
20 ppm/°C
Electrical Properties
Dielectric Constant
Dielectric Constant @ 25 ˚C/1000 kHz 3.2/0.009
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
10 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
10 ppm
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
100 mPa.s

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