OPTOLINQ LE-EP567D | Epoxy Resin for Composite Bonding

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • High bonding strength
  • Excellent insulation
  • Good chemical resistance

Product Description

OPTOLINQ LE-EP567D is a two-component, low viscosity epoxy with excellent handling properties, chemical resistance, and high-gloss finish. It is ideal for potting, casting, sealing, encapsulation, and adhesive applications for composite materials, such as carbon fiber repair. 

The hardener of LE-EP567D does not form insoluble, white solids even after being exposed to air. The cured surface remains oil-free while maintaining excellent gloss retention. Additionally, OPTOLINQ LE-EP567D offers excellent electrical insulation properties under high humidity conditions, withstands exposure to a wide range of chemicals and solvents, and complies to RoHS 2011/65/EU Directive.

Applications

  • Carbon fiber bonding and composite repairs
  • Structural adhesive applications for metals, plastics, and composite materials
  • Potting, casting, and encapsulation for electronics
  • General-purpose sealing and bonding where durability and chemical resistance are needed

 

Product Family
LE-EP567D  
Dual Syringe Cartridge Bottle
50 cc 1160 cc

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Mix Ratio
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
 1:1
Electrical Properties
Surface Resistivity 5e14 Ohms/sq
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 5.0x1015 Ohms⋅cm
Dielectric Constant
Dielectric Constant @ 23 ˚C/1 kHz 4.0
Chemical Properties
Water Absorption 0.46 %
Thermal Properties
Degradation temperature
Degradation temperature
The temperature at which the materials start losing their properties
 192 °C
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 48 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 0.3 W/m.K
Thermal Impedance 1 °C·cm²/W
Weight Loss @ 300°C 18.75 %
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 69 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 191 ppm/°C

Additional Information

LE-EP567D Recommended Curing Conditions

Property Value Unit
Mixing Ratio (A:B) 1:1 by weight
Pot Life (25℃) 15 minute(s)
Through Cure Time (25℃) 5-7 day(s)
Through Cure Time (80℃) 60 minute(s)