HGP12PT | High Thermal Conductivity Putty Pad

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.13 Thermal Impedance
  • 12 Thermal Conductivity
  • Low oil bleeding & Low volatile

Product Description

Solstice HGP12PT is an ultra-soft, high performance thermal putty pad engineered for pressure-sensitive electronic assemblies. With a thermal conductivity of 12.0 W/m·K, it provides excellent heat dissipation across varying bond line thicknesses while maintaining very low mechanical stress on delicate components.

The special polymer formulation allows Solstice HGP12PT to conform easily to uneven surfaces and fill gaps with multiple tolerances. Its tacky surface improves adhesion and contact wetting, while a fiberglass reinforcement layer enhances mechanical integrity for easier handling and application.

Designed for use in telecommunications, data centers, lighting, and automotive control units, HGP12PT combines performance, reliability, and ease of use for demanding electronic environments.

Applications

  • Telecommunications and networking modules
  • GPUs, CPUs, and data-center processors
  • High-power LED and LCD lighting assemblies
  • Solid-state drives (SSD) and memory modules
  • Wireless communication and base-station equipment
Product Family
HGP12PT  
457 x 457 x 1.0mm

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Red
Film Thickness
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
 0.5 - 2 mm
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 3.3
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 12.0 W/m.K
Thermal Impedance 0.13 °C·cm²/W
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V-0
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 1.0x1013 Ohms⋅cm

Additional Information

Frequently Asked Questions About HGP12PT (12 W/m·K Ultra-Soft Thermal Putty Pad)

What are typical applications for HGP12PT?


HGP12PT is commonly used in thermal management of sensitive electronics that require extreme softness and stress-free assembly.

  • Telecommunications equipment
  • GPU and data center systems
  • High-power lighting (LED, LCD, optical)
  • SSD thermal pads for controllers and NAND
  • Wireless and RF modules

Why choose HGP12PT over alternatives?


HGP12PT provides 12 W/m·K conductivity in an ultra-soft, tacky putty format reinforced with fiberglass. It fills difficult gaps, minimizes mechanical stress, and maintains low oil bleed and low siloxane levels for contamination-sensitive assemblies.

What is the shelf life of HGP12PT?

HGP12PT has a shelf life of 12 months when stored at 0–35°C.

How do I clean tools after applying HGP12PT?

Tools can be cleaned with electronics-safe solvents such as isopropyl alcohol to remove tacky silicone residues.

What happens after shelf life?

After shelf life, the pad’s softness and tackiness may shift, potentially affecting gap-fill behavior and performance consistency.

How do I cure HGP12PT?

HGP12PT is a non-curing thermal putty pad. It is installed directly without heating or UV exposure.

What thickness should I apply?

HGP12PT is available in 0.5–5.0 mm thickness. Select the thickness that matches your gap requirements and compression tolerance.

How is it applied and removed?

The pad can be placed manually. Its tacky surface keeps it in position during assembly. It can be peeled off and replaced during rework as needed.

What temperatures can it withstand?

HGP12PT operates reliably from -40°C to +125°C.

Any safety or storage tips?

Store at 0–35°C. Avoid dust contamination on the tacky pad surface. Handle using standard guidelines for silicone-based thermal pads.

Learn More About HGP12PT (12 W/m·K Ultra-Soft Putty Pad)

HGP12PT is an ultra-soft thermal putty pad designed to fill complex gaps with minimal force. Its tacky surface promotes good wetting, while the fiberglass reinforcement provides mechanical stability during handling and installation.

Key Features at a Glance

  • ✔ 12.0 W/m·K thermal conductivity
  • ✔ Ultra-soft, highly conformable structure
  • ✔ Tacky surface for excellent wetting
  • ✔ Fiberglass reinforcement
  • ✔ Low volatile and low oil bleed
  • ✔ UL 94 V-0 flame retardancy
HGP12PT pad sample
HGP12PT used in GPU module

Versatile Application Methods 

Application Methods

HGP12PT is placed manually onto components. Its tacky surface ensures good adhesion during assembly, and the fiberglass layer maintains pad integrity during installation.

Reliable Across Environments 

Low oil bleed, low volatility, and consistent putty-like mechanical behavior ensure reliable long-term operation from -40°C to +125°C.

Compliance You Can Trust ✅

HGP12PT meets the key requirements for high-reliability thermal interface materials.

  • UL 94 V-0 flame retardant
  • Low volatile content (ASTM E595)
  • Low siloxane (D3–D10 <100 ppm)
  • ASTM D5470 thermal validation
  • ASTM D257 electrical insulation
  • Operating temperature -40°C to +125°C


High-Heat, High-Conformability Applications for HGP12PT

Case 1: High-Power Server VRMs and Memory Modules with Component Height Variation

Server motherboards frequently have inconsistent component heights that create uneven gap distances for VRMs, power inductors, and memory modules. Standard pads may not compress enough in low-pressure zones, leaving air pockets.
Case 5: Power Modules and IGBT Assemblies with Warpage or Bowed Substrates

Power semiconductor baseplates, especially copper or DBC surfaces, may warp during manufacturing or thermal cycling, creating uneven contact areas.
Case 3: Filling Large and Irregular Gaps in Automotive Power Control Units (PCUs)

Modern PCUs often have uneven housings and components with large mechanical tolerances. Traditional gap pads cannot fully conform to deep surface irregularities, resulting in poor contact and high thermal resistance.
Case 4: Telecom RF Amplifiers and Baseband Units with Tight Assembly Tolerances

5G and telecom hardware include sensitive and densely packed RF systems where slight misalignments create unpredictable air gaps.

Solstice HGP12PT Solution

The putty pad accommodates complex geometries and pressure variations, ensuring consistent heat transfer from RF chipsets and PA modules. Its low-modulus and compressible nature protects fragile components while preventing hotspot formation during continuous transmission. The material remains stable under high ambient temperatures common in telecom shelters and outdoor cabinets.