HGP12PT | High Thermal Conductivity Putty Pad

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
  • 0.13 Thermal Impedance
  • 12 Thermal Conductivity
  • Low oil bleeding & Low volatile

Product Description

Solstice HGP12PT is an ultra-soft, high performance thermal putty pad engineered for pressure-sensitive electronic assemblies. With a thermal conductivity of 12.0 W/m·K, it provides excellent heat dissipation across varying bond line thicknesses while maintaining very low mechanical stress on delicate components.

The special polymer formulation allows Solstice HGP12PT to conform easily to uneven surfaces and fill gaps with multiple tolerances. Its tacky surface improves adhesion and contact wetting, while a fiberglass reinforcement layer enhances mechanical integrity for easier handling and application.

Designed for use in telecommunications, data centers, lighting, and automotive control units, HGP12PT combines performance, reliability, and ease of use for demanding electronic environments.

Applications

  • Telecommunications and networking modules
  • GPUs, CPUs, and data-center processors
  • High-power LED and LCD lighting assemblies
  • Solid-state drives (SSD) and memory modules
  • Wireless communication and base-station equipment
Product Family
HGP12PT  
457 x 457 x 1.0mm

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Red
Film Thickness
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
 0.5 - 2 mm
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 3.3
Outgassing
CVCM
CVCM
Collected Volatile Condensable Materials
 0.03 %
TML
TML
Total Mass Loss
 0.11 %
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 12.0 W/m.K
Thermal Impedance 0.13 °C·cm²/W
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V-0
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 1.0x1013 Ohms⋅cm
Dielectric Constant
Dielectric Constant @ 1000 kHz 8
Mechanical Properties
Hardness
Durometer (Shore 00) 15

Additional Information

Mechanical Response and Thickness Stability Under Compression

HGP12PT exhibits a controlled mechanical response that supports predictable behavior during assembly processes involving variable clamping pressure. With a Shore 00 hardness of 15, the material undergoes significant deformation at low force while maintaining uniform density across the compressed area. This helps preserve consistent interface thickness in assemblies where the gap may adjust dynamically as screws, clips, or automated press systems reach final torque.

The material is available in a 0.5–5.0 mm thickness range, enabling engineers to match pad thickness to target bond line heights without relying on excessive compression. This reduces the risk of component tilt or uneven contact that can occur when softer putty pads lack internal structural control.

HGP12PT’s formulation also exhibits low elastic recovery after compression. This behavior stabilizes the interface once the pad is seated, minimizing rebound that could otherwise affect the mechanical load on pressure-sensitive components or alter standoff height within multi-board assemblies.

This combination of low-hardness compliance, thickness versatility, and limited recovery movement enables HGP12PT to maintain a more controlled and predictable bond line in systems that cannot tolerate height variation or fluctuating compression forces.