Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
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Identifying resin bleed, separation and outgassing causes and troubleshooting the process, equipment and materials to reduce or eliminate it.
When it comes to high thermal conductivity die-attach options, an engineer is presented with four basic options: Electrically Conductive Die Attach Pastes Semi-Sintering Die Attach Pastes Silver Sintering Pastes Solder […]
CAPLINQ Europe BV will be exhibiting at this years’ Productronica 2019 and SEMICON 2019 conference in Messe München, Germany on the 12th – 15th November 2019. Visit us in Hall B3 at booth 547. […]