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Camera Module Assembly
The modern camera module is far more than just a tool for taking photos; it's the core sensor that enables devices to see and understand the world. This tiny, integrated system is driving the next wave of intelligent technology across every industry.
From allowing your smartphone to recognize your face for secure payments, to guiding an autonomous vehicle safely through traffic, to inspecting micro-components on a factory floor, camera modules are the essential eyes of AI and machine vision. Their compact size and versatility make them essential components in a wide range of applications, including medical diagnostics, robotics, security, and consumer electronics.
Camera Module Assembly
Components:
To achieve this level of intelligent vision, the phone’s camera module is built from several highly precise, integrated components:
Substrate & PCB
The foundation of the module. This circuit board (often FPC) provides electrical connection and mechanical support for all components.
Processor
The module’s “brain.” It processes raw data from the sensor, performing noise reduction, color correction, and sharpening.
Image Sensor
The digital film of the camera. A grid of light-sensitive pixels that converts light into electrical signals.
IR Cut Filter
A filter that blocks invisible infrared light, ensuring accurate and natural color capture in the final image.
Actuator
An electro-mechanical component (VCM) that moves the lens system for autofocus (AF) or Optical Image Stabilization (OIS).
Lenses
A stack of optical elements designed to gather light and focus it sharply onto the image sensor.
Lens Holder
Securely houses and aligns lens elements, maintaining precise optical positioning for consistent image quality.
Housing Assembly
The outer shell that protects the lens and actuator system, maintaining structural integrity and shielding from dust.
Stiffener
A metal shield providing extra protection and rigidity, safeguarding the module against physical damage and drops.
Camera Module Assembly Flow
The camera module is assembled through a sequence of precision processes to integrate the optical, electronic, and mechanical components. Each step ensures correct alignment, electrical connectivity, and mechanical stability for high-performance imaging in compact devices.
Introduction: Advanced Adhesives for Camera Module Assembly
In the world of high-performance camera modules, success is measured in microns. As cameras become smaller, more powerful, and more complex, the role of advanced adhesives has evolved from simple bonding to a critical engineering component. At Caplinq, we offer a comprehensive portfolio of specialized adhesives tailored to meet the demanding requirements of every step in the camera module assembly process, ensuring precision, reliability, and manufacturability at scale.
The Challenge: Pushing the Boundaries of Miniaturization
Modern camera module assembly presents a unique set of engineering challenges:
Extreme Precision
Aligning optical components with sub-micron accuracy is essential for image quality. Even minimal misalignment can cause distortion, focus errors, or color fringing in high-resolution sensors.
Component Protection
Delicate parts like lenses, sensors, and actuators must be protected from shock, vibration, and environmental stress. Structural design and encapsulation materials play key roles in maintaining stability and durability.
High-Volume Manufacturing
Camera module assembly relies on automated lines where adhesives and bonding materials must cure within seconds. This ensures continuous throughput without sacrificing precision or quality.
Long-Term Reliability
Each bond and mechanical joint must remain stable throughout the product’s lifespan, enduring years of temperature cycling, humidity, and mechanical stress without degradation in performance.
Our adhesives are engineered from the ground up to solve these challenges, enabling you to build the next generation of camera technology with confidence.
Our Adhesive Solutions: A Bond for Every Critical Joint
We offer a comprehensive suite of adhesives, each specifically tailored for a particular application within the camera module.
1. Bonding Lens Holder to Substrate
Active Alignment & House Assembly
This is the most critical bond for autofocus cameras. Our dual-cure (UV + Thermal) adhesives are the industry standard for active alignment, providing an instant UV "tack" to lock in perfect focus, followed by a full thermal cure for maximum structural strength and long-term reliability.
Key Properties:
- Ultra-low shrinkage
- Excellent adhesion to LCP/PC plastics and FR4
- High reliability
2. Lens & Barrel Assembly
Lens Locking, Lens Bonding, IR Filter Sealing
For the assembly of the core optical unit, our one-step UV-cure adhesives provide the speed and precision required. They create stress-free bonds that protect the delicate lenses and form a perfect, contaminant-free seal. Some designs require low-temperature curing epoxy.
Key Properties:
- Rapid "snap cure" (1–3 seconds)
- Low outgassing, high thixotropy (no-flow)
- Excellent optical clarity, high viscosity
3.1 Structural & FPC Reinforcement
Bracket Fill
Bracket Fill (also called Side Fill) is the process of dispensing a specialized adhesive into the tiny gaps between the fully assembled camera module and its surrounding metal bracket or shield.
Key Properties:
- Low viscosity & excellent flow
- Low-temperature cure
- High adhesion strength
- Controlled modulus (toughness) to absorb impact energy without cracking
3.2 Structural & FPC Reinforcement
Flex Attach
To ensure durability against drops and impacts, our gap-filling epoxies and flexible adhesives provide critical structural reinforcement. They absorb shock, dampen vibration, and protect the fragile FPC connection points from tearing or cracking.
Key Properties:
- Low viscosity for excellent gap-filling (Bracket Fill)
- High flexibility and fatigue resistance (FPC Reinforcement)
4. Die Attach and Underfill
Bonding Image Sensor to Substrate
The foundation of the module requires a stable, reliable bond. Our thermally conductive die-attach adhesives provide a rock-solid foundation for the image sensor while efficiently pulling away heat, which is critical for maintaining high image quality. Our Underfill can ensure bump reinforcement and protect the connection of the camera module to the PCB during reliability testing and in use.
Key Properties:
- High thermal conductivity, low-temperature cure, and excellent reliability
- Underfill with high thixotropic index, controlled flow, good bump coverage, and good fillet capability
5. VCM (Voice Coil Motor) Assembly
The assembly of the autofocus motor requires robust, precise bonding. Our structural adhesives provide the exceptional strength needed to secure magnets and delicate springs, ensuring flawless and reliable motor performance over billions of cycles.
Key Properties:
- High bond strength
- high thixotropy
- low-temperature thermal cure to protect sensitive components.