Hysol GR910-C4 |Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Hysol GR910-C4 |Black Epoxy Mold Compound

Main features

Improved version of GR910-C
Lower smile warpage
Smaller cut size (53um)

Product Description

Hysol GR910-C4 is an improved version of GR910-C. This black, epoxy, semiconductor grade molding compound is designed for Memory ball grid arrays (BGA) and land grid arrays (LGA). Its small spherical silica cut (cut size of 53um), offers high fluidity and low smile shrinkage that aids a very advanced warpage control.

There are two main differences between Hysol GR910-C4 and GR910-C.

The first one is the filler cut size: C4 cut size is 53microns; C cut size is 75 microns. When a package design has very narrow gaps (100microns), C4 will be a better candidate and have better filling performance than C.
The second and maybe most important difference between them is the warpage performance. C4 has smaller smile warpage than C with everything that entails.

Hysol GR910-C4 is a halogen free, environmentally friendly compound with good electrical performance that meets UL 94 V-0 Flammability at 1/8 inch thickness. Main features are summarized:

Moldability (Check the test results)

Small filler cut (53um) to have good filling performance
Good fluidity to prevent wire sweep (W/S) failures

Reliability

Low shrinkage ratio
Low moisture absorption
Excellent warpage control during PMC and reflow process
Meet MSL3 @260°C requirements
Proven reliability performance on BGA/LGA package

Check the BGA package key considerations.

Check GR910 series comparison

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Filler Content

88 %

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

Shelf Life
Shelf Life @ 5°C	183 days

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

3.0x10¹⁶ Ohms⋅cm

Chemical Properties

Moisture absorption

0.3 %

Physical Properties

Spiral Flow @ 175°C

170 cm

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

130 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

1 W/m.K

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	8 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	28 ppm/°C

Gel Time
Gel Time @ 175°C / 347°F	44 s

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	20000 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	140 N/mm2