Hysol MG15F-0140B | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Hysol MG15F-0140B | Black Epoxy Mold Compound

Main features

Anhydride cured
Tg: 185°C
For power discretes and high voltage rectifiers

Product Description

Hysol MG15F-0140B is a black, semiconductor grade, anhydride curing epoxy molding compound designed for high voltage power applications requiring good electrical stability at high temperature. A real classic. The work horse, as the industry would call it, product of the halogen and anhydride containing chemistries.

Hysol MG15F-0140B was typically used for power discretes and high voltage rectifiers. Despite its glorious history, the industry has been leaning towards next generation compounds that are future proof while still maintaining the same, or sometimes even better mold properties. GR 750 and the GR 750 XX series in general have nothing to envy and are good drop in candidates for the old guard.

MG15F-0140B will be the successor of MG15F-0140 by the end of this year since it does not contain (Dechlorane Plus), which will be banned by the Chinese government by 2024.

Product Family
MG15F-0140B

1. Select Product Form

Powder

2. Available Pellet Size

N/A mm

3. Available Pellet Weight

N/A gr

4. Available Package Size

1 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties
Color Color The color	black
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.	1.81
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.	185 °C
UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole	V0
Physical Properties
Spiral Flow @ 175°C	56 cm
Curing Conditions
Transfer Pressure	42-84 kg/cm2
Transfer Time	6-15 s

Additional Information

Property Comparison Table of Hysol MG 15F-0140B vs Hysol MG15F-0140

Property	Unit	MG 15F-0140B	MG15F-0140
Gel time at 175°C	s	18	17
Spiral flow at 175°C	cm	56	56
Filler content	%	-	69
Shelf life at 5°C	days	365	365
Preheat temperature (conventional mold)	°C	77 to 94	75 to 95
Molding temperature	°C	177 to 200	175 to 200
Molding pressure	kgf/cm²	42 to 84	42 to 84
Transfer time	s	6 to 15	6 to 15
Curing time (3 mm) at 177°C	s	60 to 75	60 to 75
Curing time (3 mm) at 190°C	s	45 to 60	45 to 60
Post cure time at 175°C	h	8 to 12	8 to 12
Post cure time at 190°C	h	2 to 4	2 to 6
Glass transition temperature (Tg)	°C	185	195
CTE (alpha 1) below Tg	ppm/°C	22	21
CTE (alpha 2) above Tg	ppm/°C	57	70
Specific gravity	-	1.81	1.81
Molded shrinkage	%	0.34	0.2
Flexural strength	MPa	115	127.5
Flexural modulus	GPa	10.3	13.7
Thermal conductivity	W/m-K	-	0.65
Moisture absorption at 85°C/85% RH, 168 h	%	-	0.5
Volume resistivity at 500 V @ 21°C	ohm-cm	4.3 × 10¹⁶	3.0 × 10¹⁶
Extractable ionic content: Chloride (Cl-)	ppm	9.9	-
Extractable ionic content: Sodium (Na+)	ppm	5	-
Water extract conductivity	micromhos	-	3
pH of extract	-	-	5.4
Flammability rating at 3 mm	UL-94	V-0	V-0

Notes: Values are typical and should be confirmed against the latest product TDS and your process conditions. "-" indicates not yet available

This table summarizes and compares typical processing and cured-performance properties for two anhydride-cured epoxy molding compounds used in high-voltage power applications, showing that the molding window and cure conditions are broadly similar (gel time, spiral flow, transfer time, and cure schedules), while key material differences appear in thermo-mechanical and moisture-related behavior: MG15F-0140B reports lower Tg (195°C vs 185°C), lower CTE above Tg (70 vs 57 ppm/°C), lower flexural modulus (13.7 vs 10.3 GPa), but higher molded shrinkage (0.2% vs 0.34%), while both grades meet UL-94 V-0 at 3 mm and show high volume resistivity at 500 V and 21°C.