ALPHA OM-535

Harmonization Code : 3810.10.00 |   Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
  • Enables elimination of a second or third reflow cycle
  • 8+ Hour stencil life
  • Compatible with all commonly used Pb-free surface finishes

Product Description

ALPHA OM-535 features a low-temperature solder paste technology that enables a single reflow application for the assemby of double-sided boards. It has excellent no-solder drip phenomena during the reflow process. ALPHA OM-535 with SBX02 alloy has been successfuly used with peak reflow profiles between 155 - 190℃. This version also shows a higher mechanical strength and drop shock resistance than SnBi0.4Ag alloy. The flux in ALPHA OM-535 has excellent electrical resistivity than exceeds industry standards.

ALPHA OM-535 enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through-hole components are used in an assembly.

Product Key Features

  • Increased daily throughput, eliminating the need for managing wave solder.
  • Removes the need for an extra SMT process, which significantly lower the cost of producing an electronic assembly.
  • The alloys yield very low voiding BGA solder joints, even when a traditional  SAC alloy sphere is used.

Applications

  • Assembly of double-sided boards requiring a single reflow application.
  • Applications demanding low-temperature soldering and reflow profiles between 155 - 190℃
Product Family
AP-OM535  
SBX02
1kg Unit
T4

Catalog Product

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Technical Specifications

General Properties
Color
Color
The color
Light Yellow ~ Yellow Residue

Additional Information

OM-535 Reflow Profile

Reflow Profile

Application

  • STENCIL: Recommend ALPHA CUT, ALPHA NICKEL-CUT, ALPHA TETRABOND®, or ALPHA FORM stencils @ 0.100 mm - 0.150 mm (4-6 mil) thick for 0.4 - 0.5 mm (0.016” or 0.020”) pitch. Stencil design is subject to many process variables. Contact your local Alpha stencil site for advice. 
  • SQUEEGEE: Metal recommended 
  • PRESSURE: 0.21 - 0.36 kg/cm of blade (1.25 -2.0 Ibs/inch) 
  • SPEED: 25 – 100 mm per second (1 – 6 inches per second) 
  • PASTE ROLL: 1.5-2.0 cm diameter and make additions when roll reaches 1 cm (0.4”) diameter (min). Max roll size will depend upon blade. 
  • STENCIL RELEASE SPEED: 1 – 5 mm/sec 
  • LIFT HEIGHT: 8 – 14 mm(0.31 – 0.55”)