BMC-G241 | Black Optocoupler Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Good reflectance
- Heat-resistant
- Ideal spiral flow
Product Description
OPTOLINQ BMC-G241 is a coupler epoxy molding compound specifically formulated for encapsulating optoelectronic devices. BMC-G241 offers superior performance and protection for a wide range of optoelectronics applications.
Product Key Features
- Excellent Moldability — Has a suitable spiral flow, allowing for easy and precise molding under various conditions, ensuring consistent and high-quality encapsulation of intricate optoelectronic components.
- High Performance — Features high heat resistance and reflectance, which are crucial for maintaining the performance and longevity of optoelectronic devices.
- Enhanced Reliability — BMC-G241 delivers exceptional reliability, ensuring that encapsulated devices perform consistently and have a long operational lifespan.
Applications
OPTOLINQ BMC-G241 is ideal for applications requiring the reliable encapsulation of optoelectronic devices, including:
- Optocouplers
- Sensors
OPTOLINQ BMC-G241 is recommended for use in conjuction with CHEMLINQ semiconductor mold maintenance products to ensure proper release from mold dies.
Technical Specifications
| General Properties | |
| Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. | 1.9-2.1 |
| Thermal Properties | |
| Glass Transition Temperature (Tg) Glass Transition Temperature (Tg) The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. | 155 °C |
| UL 94 Rating UL 94 Rating Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole | V-0 |
| Mechanical Properties | |
| Molded Shrinkage | 0.5 % |
| Physical Properties | |
| Spiral Flow @ 175°C | 60-100 cm |
