LOCTITE ABLESTIK 104

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
  • Withstands continuous service temperatures up to 230°C
  • Long working time
  • High tensile lap shear strength

Product Description

LOCTITE ABLESTIK 104 is a two-component, heat-cure epoxy adhesive with an anhydride hardener (Part B), supplied as a black liquid resin and white powder mixed at a 100:64 weight ratio. This non-conductive adhesive is formulated for assembly applications requiring very high temperature exposure, supporting continuous service from -25°C to 230°C with tested short-term resistance up to 280°C. It bonds metals, glass, ceramic, and thermoset plastic substrates and offers excellent chemical resistance, high shear strength, and a long working time of over 12 hours per 100 g mixed mass at 25°C, giving assemblers an extended window for part placement before cure.

Key features

  • High-temperature performance: Withstands continuous exposure to 230°C and has been tested to survive short-term exposures up to 280°C.
  • Extended working time: Offers a working time greater than 12 hours for a 100 g mixed mass at 25°C, allowing flexible assembly and placement time before cure.
  • High shear strength, non-conductive bonding: Delivers a tensile lap shear strength of 12.4 N/mm² (1,800 psi) on aluminum-to-aluminum joints at 25°C while remaining electrically non-conductive.

Applications / Suitable for: Assembly bonding of metals, glass, ceramic, and thermoset plastic substrates in high-temperature service environments.

Product Family
ABLESTIK 104  

Catalog Product

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Technical Specifications

General Properties
Appearance
Appearance
Appearance at room temperature.
Liquid
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.35
Outgassing
CVCM
CVCM
Collected Volatile Condensable Materials
0.08 %
TML
TML
Total Mass Loss
0.52 %
Physical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
25000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
225 °C
Operating Temperature -25 to 230 °C
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
60 ppm/°C
Mechanical Properties
Hardness
Durometer (Shore D) 90
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.0x1016 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the uncured, two-component material prior to cure.

Property Value Unit Method / condition
Mixing ratio (A:B) 100 : 64 by weight Component A : Component B
Viscosity, Part A 25,000 mPa·s (cP) @ 25°C, Component A resin
Specific gravity, Part A 1.35 Component A resin
Shelf life 183 days @ 25°C, Parts A and B
Working time >12 hours 100 g mixed mass @ 25°C
Mixed density 1.4 g/cm³ Mixed Parts A and B
Technical properties

After-processing / final-state properties

Typical properties of the fully cured material after the recommended cure schedule.

Property Value Unit Method / condition
Hardness 90 Shore D Cured material
Glass transition temperature >225 °C DSC/TMA
Coefficient of thermal expansion 60 ppm/°C TMA
Volume resistivity 10¹⁵ ohm·cm @ 25°C
Tensile lap shear strength 12.4 (1,800) N/mm² (psi) Aluminum-to-aluminum, tested @ 25°C
Tensile lap shear strength 9.7 (1,400) N/mm² (psi) Aluminum-to-aluminum, tested @ 230°C

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