DOWSIL™ TC-2035 Thermally Conductive Adhesive

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

Main features

3.3 W/m·K thermal conductivity
Ultra-thin bondline thickness
Low volatile content

Product Description

DOWSIL™ TC-2035 CV Adhesive is a two-part, heat-curable silicone thermal adhesive engineered for demanding automotive and power electronics applications requiring both reliable bonding and efficient heat dissipation. Delivering 3.3 W/m·K thermal conductivity, ultra-thin bondlines down to ≤95 μm, and low volatile content below 0.01% (D4-D10), TC-2035 CV is designed to maximize thermal transfer between substrates and heat sinks while maintaining long-term mechanical and adhesive reliability. The material develops primerless adhesion to many metals, ceramics, epoxy laminates, and filled plastics, while its elastomeric silicone chemistry provides stress relief against thermal cycling, vibration, and coefficient-of-expansion mismatch. Typical applications include bonding PCB, HDI, and DBC substrates to heat sinks in ADAS modules, ECUs, power electronics, inverters, converters, and on-board chargers.

Product Key Features

3.3 W/m·K thermal conductivity
Ultra-thin bondline thickness ≤95 μm
Low volatile content (<100 ppm D4-D10)
High-temperature stability up to 200°C
Excellent thermal performance at various bondline thicknesses
Mechanical reliability after accelerated aging
Adhesion stable or improved after aging
Excellent dielectric properties
Primerless adhesion to selected substrates
Two-part 1:1 mix ratio
15-minute cure at 115°C
3.5-hour pot life at room temperature
Suitable for automotive and power electronics applications

Product Family
DS-TC2035

1. Select Package Type

900G Kit 50Kg Kit 3.2Kg Kit

2. Available Color

White/Brown Brown

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 5 weeks

Leadtime

Shipping in 5 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Part A: White | Part B: Reddish Brown

Component System

Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.

Two Part

Density

Density
Volumetric mass per unit

3000 kg/m3

Mix Ratio

Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture

1:1

Pot Life

Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.

at 25°C: 3.5 hours

Curing Conditions

Curing Schedule
Cure Time	at 115°C: 15 min

Mechanical Properties

Hardness
Durometer (Shore D)	33

Tensile Strength
Tensile Strength Tensile Strength Tensile strength determines the resistance of a material to break under tension and it measures how much elongating load (or tensile stress) it can handle before fracture. To make it simple, it measures how much force we have to apply when pulling apart a material before it breaks.	3.7 MPa

Elongation

Elongation
Elongation is the process of lengthening something.

It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.

It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.

50 %

Physical Properties

Viscosity (Part A)

350000 mPa.s

Viscosity (Part B)

290000 mPa.s

Viscosity
Mixed Viscosity	345000 mPa.s

Electrical Properties

Dielectric Strength

Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.

Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.

As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.

22 kV/mm

Thermal Properties

Specific Heat Capacity

Specific Heat Capacity
Specific heat capacity is the amount of heat energy required to raise the temperature of a substance per unit of mass. The specific heat capacity of a material is a physical property. It is also an example of an extensive property since its value is proportional to the size of the system being examined.

0.88 J/(g⋅°C)

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

3.3 W/m.K

Additional Information

DOWSIL™ TC-2035 CV: Thermally Conductive Adhesive for Automotive Power Electronics

DOWSIL™ TC-2035 CV Adhesive is a two-part, heat-curable silicone thermally conductive adhesive designed for demanding electronics and automotive power module applications where long-term bonding, efficient thermal flow, and low bondline thickness are required. With 3.3 W/m·K thermal conductivity, minimum bondline thickness of ≤95 µm, excellent dielectric properties, and low volatile content, TC-2035 CV helps improve heat transfer between PCB, HDI, or DBC substrates and heat sinks in compact, high-power electronic assemblies.

High thermal performance for thin bondlines — TC-2035 CV delivers 3.3 W/m·K thermal conductivity with low bondline capability, helping reduce thermal resistance in power-dense electronics.

The elastomeric silicone chemistry provides stress relief against thermal cycling, vibration, and coefficient-of-thermal-expansion mismatch, while maintaining stable performance at elevated temperatures up to 200 °C.

Engineered for automotive electronics reliability — suitable for ADAS modules, ECU assemblies, power electronics, converters, inverters, on-board chargers, and substrate-to-heat-sink bonding.

As vehicle electronics become smaller and more powerful, TC-2035 CV helps create a thin, reliable, thermally conductive bond path between heat-generating substrates and thermal management hardware.

DOWSIL TC-2035 CV thermally conductive adhesive for automotive power electronics

3.3 W/m·K Thermal Conductivity • ≤95 µm BLT • Low Volatile Content • Stable up to 200 °C

Features & Benefits

High thermal conductivity — 3.3 W/m·K for efficient heat dissipation.
Low bondline thickness — minimum BLT of ≤95 µm.
Low volatile content — D4-D10 content below 0.01%.
High-temperature stability — stable performance up to 200 °C.
Primerless adhesion — bonds to selected metals, ceramics, laminates, and filled plastics.
Mechanical reliability — maintains elastomeric properties after accelerated aging.
Excellent dielectric properties — suitable for electronic and power module assemblies.
1:1 mix ratio — convenient two-part processing by weight or volume.

Typical Applications

ADAS module assembly.
Electronic control unit, or ECU, assembly.
Power electronics thermal management.
Converter and inverter modules.
On-board charger, or OBC, assemblies.
PCB, HDI, and DBC substrate bonding to heat sinks.
Transmission, power, and conversion modules.

Automotive Electronics Perspective

Thermal Challenges in Power-Dense Automotive Modules

Automotive electronics such as ADAS controllers, ECUs, inverters, converters, and on-board chargers require materials that can provide efficient thermal transfer while maintaining durable bonding through vibration, thermal cycling, and long-term high-temperature exposure. DOWSIL™ TC-2035 CV helps address these challenges with a high-conductivity silicone adhesive that enables thin bondlines, stable dielectric performance, and reliable adhesion between organic or ceramic substrates and heat sinks.

Thermal Resistance Reduction

The combination of 3.3 W/m·K thermal conductivity and low bondline thickness helps reduce thermal resistance between substrates and heat sinks.

Automotive Reliability

The cured silicone maintains elastomeric behavior, helping absorb vibration, thermal cycling stress, and CTE mismatch in vehicle electronics.

Low-Volatile Formulation

Low D4-D10 volatile content supports sensitive electronic assemblies where contamination control and long-term reliability are important.

Typical Properties

Engineering Data for DOWSIL™ TC-2035 CV

Property	DOWSIL™ TC-2035 CV	Condition / Note
Chemistry / Type	Two-part silicone adhesive	Heat-curable system
Color	Part A: White Part B: Reddish brown	Typical appearance
Density	3.0 g/cm³	Part A and Part B
Mix Ratio	1:1	By weight or volume
Thermal Conductivity	3.3 W/m·K	Transient method
Minimum Bondline Thickness	≤95 µm	Low BLT thermal interface
Heat Cure Time	15 minutes	At 115 °C
Pot Life	3.5 hours	At 25 °C
Hardness	Shore D 33	Cured material
Tensile Strength	3.7 MPa	Typical value
Elongation	50%	Stress-relieving silicone behavior
Lap Shear Adhesion	2.9 MPa	Anodized aluminum A5052P; cohesive failure ≥90%
Dielectric Strength	22 kV/mm	At 1 mm
Linear CTE	93.6 ppm/K	-50 to 200 °C

*Typical properties are not intended for specification writing. Verify performance under actual application, substrate, process, and reliability conditions.

Applications

Where DOWSIL™ TC-2035 CV Fits

ADAS & ECU Assembly

TC-2035 CV supports thermal bonding in compact vehicle control modules where heat dissipation, dielectric performance, and long-term reliability are critical.

ADAS control units
ECU housings
High-power PCB modules

Power Electronics

Designed for bonding organic and ceramic substrates to heat sinks in power-dense modules requiring thin bondlines and stable thermal performance.

Power modules
Transmission modules
Conversion modules

EV Inverter, Converter & OBC

Suitable for electric and hybrid vehicle electronics where high thermal conductivity and strong adhesive reliability are needed under elevated temperature operation.

Inverters
DC-DC converters
On-board chargers

Processing

Mixing, Dispensing & Cure

Mixing

Mix Part A and Part B at a 1:1 ratio by weight or volume. Light-colored streaks or marbling indicate inadequate mixing.

Dispensing

Automated airless dispensing can help reduce voids and improve consistency. If de-airing is required, vacuum de-airing may be used until bubbling subsides.

Curing

Recommended heat cure is 15 minutes at 115 °C. For thicker or highly confined sections, a pre-cure at 70 °C may help reduce voids.

Technology Advantage

How TC-2035 CV Supports Automotive Electronic Design

Design Challenge	DOWSIL™ TC-2035 CV Benefit
High power density creates localized heat in compact modules.	3.3 W/m·K thermal conductivity supports efficient heat dissipation to heat sinks or housings.
Thick adhesive layers can increase thermal resistance.	Low bondline thickness capability helps enhance thermal transfer.
Automotive assemblies experience vibration, cycling, and CTE mismatch.	Elastomeric silicone chemistry helps relieve mechanical and thermal stress.
Sensitive electronics require dielectric reliability and contamination control.	Excellent dielectric properties and low volatile content support long-term module reliability.

Technical Guidance

Tips & Troubleshooting

Issue	Recommended Action
Inadequate Mixing	Confirm 1:1 mix ratio by weight or volume. Check for streaks or marbling, which may indicate incomplete mixing. Validate static mixer length and dispensing equipment settings.
Voids in Cured Adhesive	Use automated airless dispensing where possible. Apply vacuum de-airing when needed until bubbling subsides. Consider a 70 °C pre-cure for thick or confined sections.
Insufficient Adhesion	Clean substrates to remove mold release agents, oils, greases, and oxide films. Evaluate adhesion by lap shear or similar testing before production trials. Use plasma treatment, chemical etching, or primer for difficult substrates.
Thermal Performance Below Target	Review bondline thickness and compression during assembly. Ensure complete wet-out between substrate and heat sink. Minimize voids and discontinuities in the thermal path.

Package & Support

Technical Help for Automotive Electronics Thermal Management

Processing Support

Review dispense strategy and equipment compatibility.
Assess mix ratio, de-airing, and pot life requirements.
Support cure profile development for production assemblies.

Application Support

Evaluate PCB, HDI, DBC, and heat sink bonding requirements.
Review substrate compatibility and adhesion risk.
Discuss BLT, thermal resistance, dielectric, and reliability targets.

What’s Next

Thermal Adhesives for Next-Generation Automotive Electronics

As automotive electronics continue moving toward higher power density, compact module design, and increased electrification, thermal adhesives must deliver more than basic bonding. DOWSIL™ TC-2035 CV supports this trend by combining high thermal conductivity, thin bondline capability, dielectric reliability, low volatile content, and silicone stress relief for robust power electronics assembly.

Next Steps

Ready to Evaluate DOWSIL™ TC-2035 CV?

Share your module type, substrate stack-up, target bondline thickness, heat sink design, cure profile, and reliability requirements. We can help assess whether DOWSIL™ TC-2035 CV is suitable for your automotive or power electronics thermal management application.

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