DOWSIL™ TC-4060 Thermal Gel

Harmonization Code : 3910.00.00.90 |   Silicones in Primary Forms; Others
Main features
  • 6 W/m·K
  • Room-temperature cure
  • 100% silicone (PDMS) formulation

Product Description

DOWSIL™ TC-4060 Thermally Conductive Gel is a two-part, room-temperature-curing silicone gel engineered to provide efficient heat transfer from PCB-mounted components to heat sinks while maintaining a soft, compressible interface that helps protect sensitive electronics from mechanical stress. Delivering 6 W/m·K thermal conductivity, TC-4060 combines high thermal performance with excellent dielectric insulation, long-term reliability during temperature cycling up to 150°C, and resistance to environmental contaminants. Its 1:1 mix ratio, 80-minute pot life, and compatibility with automated meter-mix dispensing systems support seamless integration into high-volume manufacturing processes. Once cured, the 100% silicone (PDMS) gel acts as a durable thermal interface that absorbs shock, vibration, and thermal expansion mismatch while maintaining consistent thermal contact over time.

Product Key Features

  • 6 W/m·K thermal conductivity for efficient heat dissipation.

  • Soft, compressible silicone gel for stress relief and vibration damping.

  • Room-temperature cure in 24 hours at 22°C.

  • Optional heat-accelerated cure in 30 minutes at 80°C.

  • 100% silicone (PDMS) formulation for long-term durability and stability.

  • Designed for automated meter-mix dispensing and high-volume manufacturing.

  • Excellent dielectric properties with 9 kV/mm dielectric strength.

  • High electrical insulation with volume resistivity of 4 × 10¹² Ω·cm.

  • Long-term thermal cycling stability up to 150°C.

  • Optional 250 µm glass beads available for bondline thickness control.

  • Shock and vibration absorption for improved reliability of sensitive electronics.

  • Suitable for PCB-to-heat-sink cooling, power electronics, industrial controls, telecom systems, and electronic modules.

Product Family
DS-TC4060  
80Kg Kit 40Oz Kit 22Kg Kit
White Blue

Catalog Product

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Shipping in 5 weeks
Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Part A: White | Part B: Blue
Component System
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
 Two Part
Mix Ratio
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
 1:1
Pot Life
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.

It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
 @22°C 80 minutes
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 Part A/B: 3.5
Physical Properties
Viscosity (Part A) @1/s 450000 mPa.s
Viscosity (Part B) @1/s 540000 mPa.s
Viscosity
Mixed Viscosity @1/s 450000 mPa.s
Curing Conditions
Curing Schedule
Cure Time @22°C 1440 min
Cure Time @80°C 30 min
Mechanical Properties
Hardness
Durometer (Shore 00) 24h @25°C 55
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 5.6 W/m.K
Electrical Properties
Dielectric Strength
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.

Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.

As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
 9 kV/mm
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 4.0x1012 Ohms⋅cm

Additional Information

DOWSIL™ TC-4060: 6 W/m·K Thermally Conductive Silicone Gel

DOWSIL™ TC-4060 Thermally Conductive Gel is a two-part, room-temperature-curing silicone gel designed to dissipate heat from PCB-mounted components to heat sinks while providing a soft, compressible thermal interface. With 6 W/m·K thermal conductivity, long-term stability during temperature cycling up to 150 °C, and optional 250 µm glass beads for bondline control, TC-4060 supports reliable thermal management in compact electronic assemblies.

High thermal conductivity with soft gel compliance — TC-4060 delivers 6 W/m·K thermal conductivity while curing into a soft elastomer that helps absorb stress, vibration, and thermal expansion mismatch.

Designed for automated meter-mix dispensing, TC-4060 supports smooth production line integration for electronics requiring reliable heat transfer from components to heat sinks, housings, or cold plates.

Soft, compressible thermal gel for reliable cooling — suitable for PCB-mounted components, heat sink interfaces, power electronics, control modules, and compact electronics where high thermal conductivity and stress relief are required.

The 100% silicone PDMS chemistry helps provide durable dielectric insulation, environmental protection, and resistance to ozone, UV degradation, and broad temperature and humidity conditions.

DOWSIL TC-4060 thermally conductive gel for PCB to heat sink cooling

6 W/m·K Thermal Conductivity • Room-Temperature Cure • Soft Gel Compliance • Stable up to 150 °C

Features & Benefits

  • High thermal conductivity — 6 W/m·K for efficient heat transfer.
  • Soft and compressible cured gel — helps reduce stress on sensitive components.
  • Room-temperature cure — cures in 24 hours at 22 °C.
  • Optional heat acceleration — cures in 30 minutes at 80 °C.
  • 100% silicone PDMS — durable silicone chemistry for electronics reliability.
  • Optional 250 µm glass beads — supports controlled bondline design.
  • Excellent dielectric performance — 9 kV/mm dielectric strength and high volume resistivity.
  • Automated dispensing compatible — designed for meter-mix equipment.

Typical Applications

  • PCB-mounted component cooling.
  • Component-to-heat-sink thermal interfaces.
  • Power electronics thermal management.
  • Electronic control modules.
  • Telecom and industrial electronics.
  • Automated meter-mix dispense applications.
  • Soft gap-filling thermal interfaces requiring stress relief.
Electronics Thermal Management Perspective

Thermal Challenges in PCB and Module Cooling

As electronic assemblies become more compact and power-dense, designers need thermal interface materials that can efficiently transfer heat while protecting sensitive components from mechanical stress. DOWSIL™ TC-4060 addresses these needs with a high-conductivity silicone gel that cures into a soft, compressible elastomer, helping move heat from PCB-mounted components to heat sinks while absorbing shock, vibration, and thermal cycling stress.

High Heat Transfer
6 W/m·K thermal conductivity helps create an efficient path from hot components to heat sinks or thermal hardware.
Stress Relief
The soft gel structure helps reduce mechanical stress from thermal expansion mismatch, shock, and vibration.
Production Integration
The two-part 1:1 system is designed for automated meter-mix dispensing and smooth assembly line integration.
Typical Properties

Engineering Data for DOWSIL™ TC-4060

Property DOWSIL™ TC-4060 Condition / Note
Chemistry / Type Two-part silicone gel 100% silicone PDMS
Mix Ratio 1:1 By weight or volume
Appearance Part A: White
Part B: Blue		 Typical appearance
Thermal Conductivity 6 W/m·K CTM 1163 A
Thermal Conductivity 5.6 W/m·K ASTM D5470
Cure Time at 22 °C 24 hours Room-temperature cure
Cure Time at 80 °C 30 minutes Heat-accelerated cure
Pot Life at 22 °C 80 minutes ASTM D1824
Durometer Shore 00 55 After 24 h at 25 °C
Durometer Shore 00 58 After 1 h at 110 °C
CTE 230 ppm/°C Typical value
Dielectric Strength 9 kV/mm Electrical insulation
Volume Resistivity 4E+12 Ohm·cm Typical value
Useful Temperature Range -40 to 150 °C Long-term operation

*Typical properties are not intended for specification writing. Verify performance under actual application, substrate, assembly, and reliability conditions.

Applications

Where DOWSIL™ TC-4060 Fits

PCB Component Cooling
TC-4060 is designed to dissipate heat from components mounted on printed circuit boards to heat sinks or cooling structures.
  • Processors and ICs
  • Power components
  • High-density PCB modules
Power Electronics
The soft silicone gel helps create a thermally conductive path while reducing mechanical stress in power-dense electronic modules.
  • Converters
  • Inverters
  • Control electronics
Automated Dispensing
Designed for smooth assembly line integration using automated metered mixing and dispensing equipment.
  • Meter-mix dispense
  • High-volume electronics assembly
  • Controlled thermal interface placement
Processing

Mixing, Dispensing & Cure

Mixing

Mix Part A and Part B at a 1:1 ratio by weight or volume. A static mixer is recommended for manual and automated mixing.

Dispensing

Use automated metered mixing and dispensing equipment for smooth line integration. Automated airless dispensing can help reduce or avoid de-airing.

Curing

Cures at 22 °C in 24 hours, with optional heat acceleration to 30 minutes at 80 °C. Cure progresses evenly without by-products.

Technology Advantage

How TC-4060 Supports Reliable Thermal Design

Design Challenge DOWSIL™ TC-4060 Benefit
High-power components generate localized heat on PCB assemblies. 6 W/m·K thermal conductivity supports efficient heat transfer to heat sinks.
Rigid materials can transfer stress to sensitive solder joints and components. Soft, compressible gel helps absorb mechanical stress, shock, and vibration.
Production lines require consistent dispensing and assembly integration. Two-part 1:1 formulation supports automated meter-mix dispensing.
Electronics require insulation and environmental protection. Silicone gel provides dielectric insulation, moisture barrier support, and chemical stability.
Technical Guidance

Tips & Troubleshooting

Issue Recommended Action
Inadequate Mixing
  • Confirm 1:1 mix ratio by weight or volume.
  • Use a static mixer for manual or automated mixing.
  • Check for streaks or marbling, which may indicate incomplete mixing.
Voids in Cured Gel
  • Use automated airless dispensing where possible.
  • If de-airing is required, apply vacuum until bubbling subsides.
  • Minimize trapped air during dispensing and component placement.
Filler Settlement Concern
  • Thoroughly mix each container before use if stored for several weeks.
  • Inspect material uniformity before production dispensing.
  • Keep containers tightly closed and follow label storage instructions.
Thermal Performance Below Target
  • Ensure complete surface wet-out between component and heat sink.
  • Review bondline thickness and compression during assembly.
  • Reduce voids and gaps in the thermal path.
Package & Support

Technical Help for Thermal Gel Applications

Processing Support
  • Review meter-mix dispensing strategy.
  • Assess cure profile and production flow requirements.
  • Support void reduction and de-airing evaluation.
Application Support
  • Evaluate component-to-heat-sink gap requirements.
  • Review compression, BLT, and thermal resistance targets.
  • Discuss dielectric, vibration, and thermal cycling reliability needs.
What’s Next

Soft Thermal Gels for High-Reliability Electronics

As electronics become more compact and thermally demanding, soft thermal gels offer a practical way to combine high thermal conductivity, electrical insulation, automated processing, and mechanical stress relief. DOWSIL™ TC-4060 supports this design direction with a 6 W/m·K silicone gel platform suitable for reliable component-to-heat-sink cooling.
Next Steps

Ready to Evaluate DOWSIL™ TC-4060?

Share your component type, heat sink design, target gap or bondline, compression level, cure preference, and dispensing process. We can help assess whether DOWSIL™ TC-4060 is suitable for your electronics thermal management application.

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