HumiSeal 1B31EPA Acrylic Conformal Coating

Harmonization Code : 3906909090 | Acrylic polymers in primary form Others>Others

Main features

Fast drying
MIL‑I‑46058C qualified
IPC‑CC‑830 compliant

Product Description

HumiSeal 1B31EPA is a fast‑drying, single‑component acrylic conformal coating designed to provide excellent moisture and environmental protection for printed circuit assemblies. The cured film exhibits outstanding flexibility, fluoresces under UV light for easy inspection, and allows straightforward repair. HumiSeal 1B31EPA is MIL‑I‑46058C qualified, IPC‑CC‑830 compliant, RoHS Directive 2002/95/EC compliant, and EPA 33/50 compliant.

Product Key Features

Single‑component acrylic formulation
Fast drying, enabling efficient throughput
MIL‑I‑46058C qualified
IPC‑CC‑830 compliant
RoHS compliant (Directive 2002/95/EC)
EPA 33/50 compliant

Applications

Protection of printed circuit boards (PCBs) across industrial, automotive, aerospace, and consumer electronics

Product Family
HS-1B31EPA

1. Select Package Size

20-liter 5-liter 1-liter

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 6 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications

Technical Specifications

General Properties

Density (g)

0.95 g/cm3

Film Thickness

Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.

25 - 75 µm

Solids

28 %

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

325 mPa.s

Thermal Properties

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

14 °C

Operating Temperature

-65 - 125 °C

Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	170 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	340 ppm/°C

Mechanical Properties

Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C	1050 N/mm2

Electrical Properties

Breakdown Voltage

Breakdown Voltage
Breakdown voltage is the minimum voltage necessary to force an insulator to conduct some amount of electricity.
It is the point at which a material ceases to be an insulator and becomes a resistor that conducts electricity at some proportion of the total current.

After dielectric breakdown, the material may or may not behave as an insulator any more because of the molecular structure alteration. The current flow tend to create a localised puncture that totally alters the dielectric properties of the material.

This electrical property is thickness dependent and is the maximum amount of voltage that a dielectric material can withstand before breaking down. The breakdown voltage is calculated by multiplying the dielectric strength of the material times the thickness of the film.

6300 V