-
Home
-
Products
-
Soldering Materials
-
Solder Flux
- KESTER 2166-BN Soldering Flux
KESTER 2166-BN Soldering Flux
Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
- Halide-free formulation
- Superior surface insulation resistance
- Easy residue removal
Product Description
Kester 2166-BN is a halide-free, organic flux designed for automated soldering of circuit board assemblies. It provides excellent activity on bare copper and solder-coated boards while ensuring easy residue removal and superior compatibility with solder resists.
Product Key Features
- Contains no chlorides, bromides, phosphates, or highly corrosive materials
- Effective on both bare copper and solder-coated boards
- Outperforms typical water-soluble fluxes, ideal for SMT assemblies
- Works well with solder resists compared to other water-soluble fluxes.
Applications
- for high-speed, automated assembly lines.
- Provides reliable soldering for advanced surface mount (SMT) electronic assemblies.
- also ideal for bare copper & solder-coated boards
Technical Specifications
| General Properties | |
| Solids | 31 % |
|
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless. |
1.144 |
Additional Information
Flux Application
2166-BN can be applied to circuit boards by a spray, dip, or wave process. An air knife after the flux tank is recommended to remove excess flux if used in a dip or wave application to remove any excess flux to prevent dripping on the preheater surface.
