KESTER® 48 Flux-Cored Wire

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • Unparalleled wetting performance
  • Low flux spatter
  • ROM1 per J-STD-004

Product Description

KESTER 48 Flux‑Cored Wire is an activated rosin flux designed for use in flux‑cored solder wire and optimized for lead‑free soldering applications. It enables reliable soldering of most common metals and delivers performance characteristics that significantly exceed standard RA fluxes.

Building on the proven performance of its predecessor, KESTER 44 Flux‑Cored Wire, 48 Flux‑Cored Wire features enhanced “instant‑action” wetting, providing fast, consistent solder flow and dependable solder joint formation across a wide range of surface finishes.

Product Key Features

  • Activated rosin flux formulated for flux‑cored solder wire
  • Designed for lead‑free soldering applications
  • Low spattering for improved process control
  • Low smoke and low odor, enhancing operator comfort
  • Classified as ROM1 per J‑STD‑004

Applications

  • Hand soldering with flux‑cored solder wire
  • Applications requiring fast wetting and strong solder joint formation
Product Family
AP-48FCW  
1kg Unit 1lb Unit

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Technical Specifications

Additional Information

Process Considerations

Solder iron tip temperatures are most commonly between 371 to 400 °C (700 to 750 °F) for lead-free alloys. Heat both the land area and component lead to be soldered with the iron prior to applying the solder wire to the land area or component lead. Do not apply the wire directly to the soldering iron tip; doing so will shorten the life of the soldering tip.

Additional liquid flux should only be used as a last resort. Any flux applied to the solder location should be kept to the area of the connection being reworked. If needed, Kester 186 or Kester NF372-TB may be used as compatible liquid fluxes to aid in reworking soldered joints. 186 and NF372-TB are also available in Flux-Pens® for optimum board cleanliness.

Cleaning

48 possesses excellent fluxing ability; the flux residue is non-corrosive and non-conductive and does not require removal for most applications under normal conditions of use. IPA will not clean the residues off the surface of the circuit board after the soldering process. A saponifier or cleaning agent specifically designed to clean a rosin-based flux is required to clean the residues. Please contact Kester Technical Support for further information.